Abstract
This work investigated the fatigue fracture characteristics of Sn-7∼11wt.%Zn and Sn-30∼50wt.%PPb solder alloys under resonant vibration. For the alloys containing proeutectic Sn-rich grains, the results show stratum appearance on the deformation of coarse proeutectic grains. This stratum-type deformation will reduce the vibration resistance of Pb-Sn solder by inducing cracks. For the Sn-Zn system, fine eutectic structure will cause cracks to form and coalesce easily in the regions concentrated with small fibrous deformation grains, whereas hypereutectic structure shows coarse proeutectic Zn-rich particles as the crack initiation sites. Sn-t-Zn solders have better damping capacity than Pb-Sn solders. With hypoeutectic composition to induce stratum-type deformation and under lower vibration strain, these lead-free solders tend to exhibit superior crack propagation resistance, and, in that respect, are possible to replace Pb-Sn solders.
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Chuang, C.M., Lui, T.S. & Chen, L.H. The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders. J. Electron. Mater. 30, 1232–1240 (2001). https://doi.org/10.1007/s11664-001-0155-3
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DOI: https://doi.org/10.1007/s11664-001-0155-3