Abstract
Low tin lead based solder fails by intergranular and/or transgranular modes depending upon experimental conditions. At low frequency and in tests with hold times separation of grains is the main mode of fracture. In the 5 to 100 °C temperature range at high frequency (> 10−2 Hz) and at high total strain range (0.75 pct) the failure mode is mixed transgranular-intergranular; at a low total strain range (0.3 pct) the mode of failure is intergranular. Change in failure mode leads to a bend in the Coffin-Manson plot. Tensile hold time and combined tensile and compressive hold times are found to reduce dramatically the fatigue cycles to failure of this solder. A simple mathematical relation between the fatigue life of the solder and ramp time, tensile, and compressive hold times is developed.
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Vayman, S., Fine, M.E. & Jeannotte, D.A. Isothermal fatigue of low tin lead based solder. Metall Trans A 19, 1051–1059 (1988). https://doi.org/10.1007/BF02628389
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DOI: https://doi.org/10.1007/BF02628389