Abstract
In the semiconductor industry at the end of the product process, manufacturers typically employ electrical tests to ensure that only high-quality products will be delivered to the customer. Furthermore, they use accelerating stress tests to investigate the reliability of their products. To improve the production process, failed devices are physically analyzed to clarify the reason for the failure.
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Crean, G. M., Flannery, C. M., and Ó. Mathúna, S. C. (1995). Acoustic microscopy analysis of microelectronic interconnection and packaging technologies. In: Advances in Acoustic Microscopy, Vol. 1 (A. Briggs, ed.), Plenum Press, New York, pp. 1–48.
Sonoscan Prospectus on SLAM (1989).
Sonoscan Prospectus on SAM (1989).
Tilgner, R., Alpern, P., Baumann, J., Pfannschmidt, G., and Selig, O. (1994). Changing states of delamination between molding compound and chip surface: A challenge for scanning acoustic microscopy. IEEE Trans. Components Packag. Manuf. Technol. B 17(3), 442–448.
Pfannschmidt, G. (1992). Ultrasonic microscope investigations of die attach quality and correlations with thermal resistance. Quality and Reliability Engineering International, Vol. 8, No. 3, pp. 243–246.
Pfannschmidt, G., and Strathausen, K. (Bosch, Reutlingen) (1993). Comparison between dye penetration test (Bosch) and acoustic microscopy (Siemens). Siemens Internal Report, HL QS AFA 2 93/009 Pfa.
Harada, M., Tanigawa, S., Ohizumi, S., and Ikemura, K. (1992). X-ray analysis of the package cracking during reflow soldering. IEEE/IRPS, pp. 182–189.
Sonoscan Workshop (1990).
Alpern, P., Pfannschmidt, G., Wagner, G., and Tilgner, R. (1993). Entmischungen bei IC-Umhüllungen? Kunststoffe 83(12), 988–991.
Pfannschmidt, G. (1994). Dark lines—Are they always the same? IPFA, pp. 264–269.
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© 1996 Springer Science+Business Media New York
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Pfannschmidt, G. (1996). Characterization of Electronic Components by Acoustic Microscopy. In: Briggs, A., Arnold, W. (eds) Advances in Acoustic Microscopy. Advances in Acoustic Microscopy, vol 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5851-4_1
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DOI: https://doi.org/10.1007/978-1-4615-5851-4_1
Publisher Name: Springer, Boston, MA
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