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Acoustic Microscopy Analysis of Microelectronic Interconnection and Packaging Technologies

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Advances in Acoustic Microscopy

Part of the book series: Advances in Acoustic Microscopy ((AAMI,volume 1))

Abstract

Several advanced packaging and interconnection technologies are currently under development to meet the requirements of complex, large and/or high-speed microelectronic integrated circuits (IC) and systems. These include the design of multilayer interconnection substrates (see Fig. 1.1) for Multichip Module (MCM) applications(1) and the development of multilayer ceramic pin grid array packages (see Fig. 1.2) for large-area die size, high pin count ICs.(2) A development road map(3) for single-chip packaging technologies is presented in Fig. 1.3.

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Author information

Authors and Affiliations

  1. National Microelectronics Research Centre, University College, Lee Maltings, Cork, Ireland

    Gabriel M. Crean & Colm M. Flannery

  2. Power Electronics Ireland, National Microelectronics Research Centre, UCC, Ireland

    Séan Cian Ó Mathúna

Authors
  1. Gabriel M. Crean
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  2. Colm M. Flannery
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  3. Séan Cian Ó Mathúna
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Editors and Affiliations

  1. University of Oxford, Oxford, UK

    Andrew Briggs

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© 1995 Springer Science+Business Media New York

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Crean, G.M., Flannery, C.M., Ó Mathúna, S.C. (1995). Acoustic Microscopy Analysis of Microelectronic Interconnection and Packaging Technologies. In: Briggs, A. (eds) Advances in Acoustic Microscopy. Advances in Acoustic Microscopy, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1873-0_1

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  • DOI: https://doi.org/10.1007/978-1-4615-1873-0_1

  • Publisher Name: Springer, Boston, MA

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