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Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity

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Abstract

Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexity of microelectronic systems and devices. Novel integration technologies that arise from these demands need to be addressed from a reliability and quality assurance perspective. As a consequence, novel and adapted inspection techniques are strongly required, including non- or semi-destructive testing during development and manufacturing. Within this context non-destructively operating scanning acoustic microscopy is an already widely used and established inspection method that provides even more potential if the corresponding performance parameters can be further improved. Currently, conventional scanning acoustic imaging is performed based on pure amplitude imaging thereby neglecting most of the information contained in the acoustic signals. The current paper exemplarily presents novel and extended approaches for addressing current limitations in conventional acoustic microscopy, including the detection and evaluation of void defects in small electrical interconnects, increasing detectability of delaminations in bonded wafers, but also the use of acoustic GHz-microscopy for increasing the spatial resolution and sub-surface sensitivity. An improved detectability and sensitivity for crack assessment using shear and mixed acoustic mode inspection is presented.

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References

  • Brand S, Lapadatu A, Djuric T, Czurratis P, Schischka J, Petzold M (2014a) Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies. J Micro/Nanolithogr MEMS MOEMS 13:1–10

    Article  Google Scholar 

  • Brand S, Lapadatu A, Djuric T, Czurratis P, Schischka J, Petzold M (2014b) scanning acoustic ghz-microscopy for metrology applications in 3d integration technologies. J Micro/Nanolithogr MEMS MOEMS 13(1):011207

    Article  Google Scholar 

  • Brand S, Appenroth T, Naumann F, Steller W, Wolf MJ, Czurratis P, Altmann F, Petzold M (2015) Acoustic GHz-microscopy and its potential applications in 3D-integration technologies. In: Electronic components and technology conference (ECTC), 2015 IEEE 65th, electronic components and technology conference (ECTC), 2015 IEEE 65th, pp 46–53

  • Briggs A (1992) Acoustic microscopy, in monographs on the physics and chemistry of materials. Oxford University Press, Oxford

    Google Scholar 

  • De Wolf I, Khaled A, Herms M, Wagner M, Djuric T, Czurratis P, Brand S (2015) Failure and stress analysis of Cu TSVs using GHz-scanning acoustic microscopy and scanning infrared polariscopy. In: ISTFA 41st international symposium for testing and failure analysis—ISTFA, pp 119–125

  • Di Cioccio L, Radu I, Gueguen P, Sadaka M (2010) Direct bonding for wafer level 3D integration. In: Proceedings of IEEE international conference on integrated circuit design and technology 2010, pp 110–113. doi:10.1109/ICICDT.2010.5510276

  • Dragoi V, Czurratis P, Brand S, Beyersdorfer J, Patzig C, Krugers J, Schrank F, Siegert J, Petzold M (2013) Low temperature fusion wafer bonding quality investigation for failure mode analysis. ECS Trans 50:227–239

    Article  Google Scholar 

  • Phommahaxay A, De Wolf I, et al. (2013) High frequency scanning acoustic microscopy applied to 3D integrated process: void detection in through silicon vias. In: Proceedings of the 2013 IEEE electronic components and technology conference

  • Phommahaxay A, De Wolf I, et al. (2014) Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics. In: Proceedings of the 2013 IEEE electronic components and technology conference, pp 850–855

  • Ramm P, Lu JJ-Q, Taklo MMV (eds) (2016) Handbook of wafer bonding. Wiley, Weinheim. ISBN 978-3-527-32646-4

    Google Scholar 

  • Tismer S, Brand S, Czuratis P, Klengel S, Petzold M (2013) Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis. in: Proceedings of the 2013 IEEE ultrasonics symposium, Prague, Czech Republic

  • Vogg G, Heidmann T, Brand S (2015) Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices. Microelectron Reliab 55:1554–1558

    Article  Google Scholar 

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Authors and Affiliations

  1. Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Center for Applied Microstructure Diagnostics, CAM, Halle, Germany

    Sebastian Brand & Matthias Petzold

  2. Infineon Technologies AG, Munich, Germany

    Günther Vogg

Authors
  1. Sebastian Brand
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  2. Günther Vogg
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  3. Matthias Petzold
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Correspondence to Sebastian Brand.

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Brand, S., Vogg, G. & Petzold, M. Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity. Microsyst Technol 24, 779–792 (2018). https://doi.org/10.1007/s00542-017-3521-7

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  • DOI: https://doi.org/10.1007/s00542-017-3521-7

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