Abstract
In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed.
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Funding
This work is financially supported by the Natural Science Foundation of Guangdong Province (No. 2019A1515011844), and the Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory (ZHD201801 and 31512050201).
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Wang, J., Chen, S., Zhang, L. et al. Brief Review of Nanosilver Sintering: Manufacturing and Reliability. J. Electron. Mater. 50, 5483–5498 (2021). https://doi.org/10.1007/s11664-021-09078-1
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DOI: https://doi.org/10.1007/s11664-021-09078-1