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Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering

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Abstract

In recent years, sintering nano-silver paste has become a popular worldwide technology. This paper presents the effect of ultrasonic vibration on the microstructure and mechanical properties of pressureless sintered nano-silver joints. Ultrasonic waves have been introduced prior to sintering using a new type of nano-silver paste in order to improve bonding of large-area chips (≥10 × 10 mm2). The results show that ultrasonic vibration can not only reduce black pores, increase the size and the density of sintered silver, but also transfer the fracture mode of joints to cohesive failure. With increasing ultrasonic power or time, the shear strength of joints gradually increases linearly. The surface of the sintered silver, the fracture surface, and the cross section of joints were examined, and the microstructure has a transition zone at the edge of the joints that is insufficiently sintered. Ultrasonic vibration can reduce the transition zone and thus improve the reliability of joints.

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Acknowledgements

The authors acknowledge the research funding by Key Project in the Science & Technology Pillar Program of Tianjin (Grant No. 11ZCKFGX03000), the Program for New Century Excellent Talents in University (NCET-11-0375), and the Specialized Research Fund for the Doctoral Program of Higher Education of China (20110032130002).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, People’s Republic of China

    Yuan Li, Hongyang Jing, Yongdian Han,  Lianyong Xu & Guoquan Lu

  2. Tianjin Key Laboratory of Advanced Joining Technology, Tianjin, 300072, People’s Republic of China

    Yuan Li, Hongyang Jing, Yongdian Han,  Lianyong Xu & Guoquan Lu

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  1. Yuan Li
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  2. Hongyang Jing
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  3. Yongdian Han
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Correspondence to Lianyong Xu.

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Li, Y., Jing, H., Han, Y. et al. Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering. J. Electron. Mater. 45, 3003–3012 (2016). https://doi.org/10.1007/s11664-016-4394-8

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  • DOI: https://doi.org/10.1007/s11664-016-4394-8

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