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Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing

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Advanced MEMS/NEMS Fabrication and Sensors

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Abstract

In this chapter, we outline the revolution of wafer bonding technologies in microelectromechanical systems (MEMS) packaging and their applications in the emerging field of micro/nanofluidics-enhanced sensing. With the rapid development of device miniaturization, high-density assembly technologies have become one of the most important research topics in three-dimensional (3D) integration. The role of packaging has also shifted from initial physical protection and electrical interconnection to a multifunctional platform and/or interfaces. Hence, wafer bonding-based packaging technologies also benefit from diversified applications, e.g., micro/nanofluidics, optoelectronic integration, and biological/chemical sensing. Based on the aforementioned aspects, we summarize the development of wafer bonding technology to enable researchers to know the recent progress of homo−/heterogeneous integration.

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Acknowledgments

This work is partly supported by research grant of CRP-15th (NRF-CRP15-2015-02) at the National University of Singapore (NUS), Singapore, and partly supported by the National Natural Science Foundation of China (grant no. 51975151) at Harbin Institute of Technology. Jikai Xu also thanks the China Scholarship Council (File No. 201906120176) for supporting this work.

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Authors and Affiliations

  1. Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore

    Jikai Xu, Zhihao Ren, Bowei Dong & Chengkuo Lee

  2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China

    Jikai Xu, Chenxi Wang & Yanhong Tian

  3. Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore, Singapore

    Zhihao Ren, Bowei Dong & Chengkuo Lee

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  1. Jikai Xu
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  2. Zhihao Ren
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  3. Bowei Dong
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  4. Chenxi Wang
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  5. Yanhong Tian
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  6. Chengkuo Lee
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Correspondence to Chenxi Wang .

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  1. National Key Laboratory of Science and Technology on Micro/Nano Fabrication School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China

    Zhuoqing Yang

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Xu, J., Ren, Z., Dong, B., Wang, C., Tian, Y., Lee, C. (2022). Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing. In: Yang, Z. (eds) Advanced MEMS/NEMS Fabrication and Sensors. Springer, Cham. https://doi.org/10.1007/978-3-030-79749-2_7

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