Microsensor packaging

Abstract

 Packaging is crucial for the success of microsensors and microsystems, and typically a major, if not dominating cost component. Benefiting from packaging methods for integrated circuits (IC), microsystem packaging currently strongly relies on customized solutions. The paper summarizes challenges in microsensor and microsystem packaging and briefly discusses current packaging trends. In the second part of the paper, a packaged low-cost CMOS thermal imager is presented. Its packaging is based on the direct attachment of a silicon infrared filter onto the CMOS sensor die. The final microsystem is further packaged in a plastic ball grid array (BGA) enabling subsequent assembly by standard surface mount technology.