Abstract
Polyorganosiloxane compounds with improved physicomechanical properties are presented. The possibility of changing the properties of adhesive sealants by introducing them into the composition of new modifying additions, structure-forming additions (QM-resins), curing accelerators, and coupling agents has been shown. The elaborated compounds can be recommended for sealing semiconductor devices and integral schemes.
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Original Russian Text © E.A. Chigorina, A.A. Arutyunyants, M.V. Bestaev, T.M. Chigorina, V.T. Abaev, 2010, published in Klei. Germetiki. Tekhnologii, 2010, No. 1, pp. 24–27.
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Chigorina, E.A., Arutyunyants, A.A., Bestaev, M.V. et al. Organosiloxane adhesive sealants with improved physicomechanical properties. Polym. Sci. Ser. D 3, 198–200 (2010). https://doi.org/10.1134/S1995421210030093
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DOI: https://doi.org/10.1134/S1995421210030093