Skip to main content
SpringerLink
Log in

Electrical measurement of a lead-free solder assembly after environmental tests by SEM internal probing

  • Lead-Free Solder
  • Research Summary
  • Published:
JOM Aims and scope Submit manuscript

Abstract

In this study, electrical characterization for lead-free materials in bump technology was developed and joint assemblies were thermally treated under temperature cycling tests. Measurements of sheet resistivity and contact resistance of intermetallic compounds (IMCs) in solder joints were conducted. Quantitative analysis and elemental redistribution of IMCs were obtained by field-emission electron probe microanalyzer. A scanning-electron microscopy internal probing system was introduced to evaluate electrical characteristics in IMCs after thermal treatments. To determine resistivity of IMCs, a novel method incorporating SELA-EM2 and a focused ion beam was developed to prepare the joint sample.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. D.G. Kim et al., J. Alloys Compd., 395 (2005), p. 80.

    Article  CAS  Google Scholar 

  2. J.M. Koo et al., Key Eng. Mater., 297 (2005), p. 801.

    Article  Google Scholar 

  3. J.W. Jang et al., J. Appl. Phys., 95 (2004), p. 8286.

    Article  CAS  Google Scholar 

  4. K.S. Bae and S.J. Kim, J. Mater. Res., 17 (2002), p. 743.

    Article  CAS  Google Scholar 

  5. D.R. Frear et al., JOM, 53(6) (2001), p. 28.

    Article  CAS  Google Scholar 

  6. B.L. Young, J.G. Duh, and B.S. Chiou, J. Electron. Mater., 30 (2001), p. 543.

    Article  CAS  Google Scholar 

  7. M. McCormack et al., Appl. Phys. Lett., 63 (1993), p. 15.

    Article  CAS  Google Scholar 

  8. J.W. Jang et al., J. Mater. Res., 19 (2004), p. 1826.

    Article  CAS  Google Scholar 

  9. J.H.L. Pang et al., Thin Solid Films, 462–463 (2004), p. 370.

    Article  CAS  Google Scholar 

  10. J.H.L. Pang et al., Design For Reliability (DFR) Methodology for Electronic Packaging Assemblies (Proceedings of IEEE, 2003 Electronics Packaging Technology Conference, Singapore 2003) (Piscataway, NJ: IEEE, 2003), pp. 470–478.

    Google Scholar 

  11. F.A. Stam and E. Davitt, Microelectronics Reliability, 41 (2001), p. 1815.

    Article  Google Scholar 

  12. J.W. Yoon, S.W. Kim, and S.B. Jung, J. Alloys Compd., 391 (2005), p. 82.

    Article  CAS  Google Scholar 

  13. S.K. Kang, R.S. Rai, and S. Purrshothaman, J. Electron. Mater., 25 (1996), p. 1113.

    CAS  Google Scholar 

  14. B.L. Young and J.G. Duh, J. Electron. Mater., 30 (2001), p. 878.

    Article  CAS  Google Scholar 

  15. C.S. Huang et al., J. Electron. Mater., 31 (2002), p. 1230.

    Article  CAS  Google Scholar 

  16. J.W. Nah and K.W. Paik, IEEE Trans. Compon. Packag. Technol., 25 (2002), p. 32.

    Article  CAS  Google Scholar 

  17. J.H. Lee et al., J. Electron. Mater., 33 (2004), p. 28.

    Article  CAS  Google Scholar 

  18. G.Y. Jang and J.G. Duh, J. Electron. Mater., 34 (2005), 68.

    Article  CAS  Google Scholar 

  19. Y.C. Lin, J.G. Duh, and B.S. Chiou, J. Electron. Mater., 35 (2006), p. 7.

    Article  CAS  Google Scholar 

  20. J.W. Kim and S.B. Jung, Mater. Sci. Eng. A, 371 (2004), p. 267.

    Article  CAS  Google Scholar 

  21. C.R. Kao, Mater. Sci. Eng. A, 238 (1997), p. 196.

    Article  Google Scholar 

  22. L. Ming et al., IEEE T. Electron. Packaging Manufacturing, 25 (2002), p. 185.

    Article  CAS  Google Scholar 

  23. S.Y. Jang et al., IEEE T. Compon. Packaging Technologies, 26 (2003), p. 245.

    Article  Google Scholar 

  24. T.I. Shih et al., J. Electron. Mater., 35 (2006), p. 1773.

    Article  CAS  Google Scholar 

  25. N.M.P. Guillaumeq, M.W. Cresswell, and R.A. Allen, Proc. IEEE 1999 Int. Conf. on Microelectronic Test Structures, 12 (March 1999).

  26. G.Y. Jang and J.G. Duh, J. Electron. Mater., 35 (2006), p. 2061.

    Article  CAS  Google Scholar 

  27. G.K. Reeves and H.B. Harrison, IEEE Electron Device Letters, EDL-3(5) (1982), pp. 111–113.

    Google Scholar 

  28. J.H. Robert, B. John, and Y. Win, Proceedings of the 4th International Workshop on Junction Technology (Piscataway, NJ: IEEE, 2004), pp. 317–320; DOI 10.1109/IWJT.2004.1306868.

    Google Scholar 

  29. L.J. van der Pauw, Philips Res. Rep., 13 (1958), pp. 1–9.

    Google Scholar 

  30. D. Lu and C.P. Wang, J. Applied Polymer Science, 74 (1999), pp. 399–406.

    Article  CAS  Google Scholar 

  31. Metal Handbook, eighth edition, Vol. 1: Properties and Selection of Metals (Materials Park, OH: ASM International, 1961), pp. 48–49.

  32. R.L. Keusseyan et al., ISHM 90 Proceedings (Chicago, Illinois; 1990), pp. 199–202.

Download references

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan, China

    T. I. Shih, Y. C. Lin &  J. G. Duh

  2. United Microelectronics Corporation, Hsin-chu, Taiwan, China

    T. I. Shih, Tom Hsu & W. S. Wu

Authors
  1. T. I. Shih
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Y. C. Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. J. G. Duh
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Tom Hsu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. W. S. Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Shih, T.I., Lin, Y.C., Duh, J.G. et al. Electrical measurement of a lead-free solder assembly after environmental tests by SEM internal probing. JOM 59, 32–37 (2007). https://doi.org/10.1007/s11837-007-0086-4

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11837-007-0086-4

Keywords

Search

Navigation