Abstract
Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
1. F. Bartels, J. Morris, G. Dalke, W. Gust. J. Electron. Mater. 23(8), 787 (1994) doi:10.1007/BF02651374
2. F.S. Shieu, C.F. Chen, J.G. Sheen, Z.C. Chang. Thin Solid Films 346(1–2), 125–129 (1999) doi:10.1016/S0040-6090(98)01737-4
3. R.W. Chuang, C.C. Lee. Thin Solid Films 414(2), 175–179 (2002) doi:10.1016/S0040-6090(02)00424-8
R.I. Made, C.L. Gan, C. Lee, L.L. Yan, Ai. Yu, S.W. Yoon, and J.H. Lau, Proc. SPIE 6884, 68810H (2008). doi:10.1117/12.762046.
Jing-Chie Lin, Long-Wei Huang, Guh-Yaw Jang, and Sheng-Long Lee. Thin Solid Films 410(1–2), 212–221 (2002) doi:10.1016/S0040-6090(02)00240-7
T.B. Massalski, H. Okamoto, P.R. Subramanian, and L.␣Kacprzak, ASM Handbook, Vol. 3 (Material Park, OH: ASM International, 1992)
7. Rita Roy and S. K. Sen. Thin Solid Films 197(1–2), 303–318 (1991) doi:10.1016/0040-6090(91)90241-O
8. R.W. Chuang, C.C. Lee. IEEE Trans. Compon. Packag. Tech. 25(3), 453–458 (2002) doi:10.1109/TCAPT.2002.801113
V. Simic, Z. Marinkovic, Thin Solid Films 61, (1979), 149. doi:10.1016/0040-6090(79)90457-7
T.H. Chuang, Y.T. Huang, and L.C. Tsau, J. Electron. Mater. 30, (2001). doi:10.1098/rspa.1966.0242.
11. J.A. Greenwood, J.B.P. Williamson. Proc. Of R. Soc. Lond. Ser. A295, 300 (1966). doi:10.1098/rspa.1966.0242
12. H.L. Leong, C.L. Gan, C.V. Thompson, K.L. Pey, H.Y. Li. J. Appl. Phys. 102(10), 103510 (2007) doi:10.1063/1.2811724
H. Hertz and J. Regine Angew, Translated and reprinted in English in Hertz’s Miscellaneous Paper (London: Macmillan & Co., 1986).
14. D.A. Porter, K.E. Easterling, Phase Transformations in Metals and Alloys. Chapman & Hall, London UK, 1992.
Acknowledgements
The authors would like to acknowledge the School of Materials Science and Engineering at Nanyang Technological University (NTU), Singapore, for providing a scholarship to Riko I Made. The authors would also like to thank the Institute of Materials Research Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), Singapore, for assistance with the Bruker-General Area Detector Diffraction System (GADDS). Chengkuo Lee, PI of IME Core Project 06-420004, would like to thank the Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), Singapore, for providing research funding for this research.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Made, R.I., Gan, C.L., Yan, L.L. et al. Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications. J. Electron. Mater. 38, 365–371 (2009). https://doi.org/10.1007/s11664-008-0555-8
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-008-0555-8