Intermetallic phase formation in thin solid-liquid diffusion couples

Abstract

Conducting joints with low fabrication temperatures and high thermal stability are useful in modern electronics. This paper discusses the potential use of intermetallic phases in making such joints. Thin interconnection layers that consist entirely of intermetallic phases have been produced by joining planar Cu substrates that are coated with thin films of Sn. Thin layers (1-5 µm) of intermetallic phase are produced at temperatures slightly above the melting temperature of Sn in a process similar to reflow soldering. Metallography and x-ray analysis are used to characterize the formation mechanism of the intermetallic. Cu dissolves into the liquid Sn by diffusion along narrow channels between grains of the growing η-Cu₆Sn₆ intermetallic phase. Tensile tests were used to measure mechanical properties. The joint strength increased with reaction time. The joint fails in a ductile mode as long as unreacted Sn is present, but fractures along interphase boundaries when the joint is completely intermetallic.