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Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

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Abstract

The cross-interaction of the under-bump metallurgy (UBM)/solder interface and the solder/surface-finish interface in flip-chip solder joints was investigated. In this study, the UBM on the chip side was a single layer of Cu (8.5 µm), and the surface finish on the substrate side was a 0.2-µm Au layer over 5-µm Ni. It was shown that, after two reflows, the Ni layer of the surface finish had been covered with (Cu1−xNix)6Sn5. This shows that the effect of cross-interaction of the two interfaces is important even during the reflow stage. During subsequent solid-state aging at 115°C, 135°C, and 155°C, the formation of (Cu1−xNix)6Sn5 over the Ni layer was found to have the effect of reducing the Ni consumption rate. At the same time, the Cu consumption rate of the UBM was accelerated. The results of this study show that the selection of the UBM and the surface finish has to be considered together because the cross-interaction of the two interfaces plays an important role.

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References

  1. K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).

    Article  Google Scholar 

  2. S.K. Kang, W.K. Choi, D.Y. Shih, P. Lauro, D.W. Henderson, T. Gosselin, and D.N. Leonard, Proc. 2002 IEEE Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2002), pp. 146–153.

    Google Scholar 

  3. K.N. Tu and K. Zeng, Mater. Sci. Eng. R 34, 1 (2001).

    Article  Google Scholar 

  4. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

    CAS  Google Scholar 

  5. A. Hayashi, C.R. Kao, and Y.A. Chang, Scripta Mater. 37, 393 (1997).

    Article  CAS  Google Scholar 

  6. C.R. Kao, Mater. Sci. Eng. A 238, 196 (1997).

    Article  Google Scholar 

  7. K.N. Tu, T.Y. Lee, J.W. Jang, L. Li, D.R. Frear, K. Zeng, and J.K. Kivilahti, J. Appl. Phys. 89, 4843 (2001).

    Article  CAS  Google Scholar 

  8. K.N. Tu and R.D. Thompson, Acta Metall. 30, 947 (1982).

    Article  CAS  Google Scholar 

  9. Z. Mei, A.J. Sunwhoo, and J.W. Morris, Jr., Metall. Trans. A 23A, 857 (1992).

    CAS  Google Scholar 

  10. C.S. Huang, G.Y. Jang, and J.G. Duh, J. Electron. Mater. 33, 283 (2004).

    Article  CAS  Google Scholar 

  11. D. Yu, L. Duan, J. Zhao, and L. Wang, Proc. 5th Int. Conf. on Electronic Packaging Technology (Piscataway, NJ: IEEE, 2003), pp. 327–329.

    Google Scholar 

  12. S.Y. Jang, W. Juergen, E. Oswin, G. Heinz, S. Thomas, R. Herbert, and K.W. Paik, IEEE Trans. Comp. Packaging Technol. 26, 245 (2003).

    Article  Google Scholar 

  13. C.S. Huang, G.Y. Jang, and J.G. Duh, J. Electron. Mater. 32, 1273 (2003).

    Article  CAS  Google Scholar 

  14. J.Y. Tsai, Y.C. Hu, C.M. Tsai, and C.R. Kao, J. Electron. Mater. 32, 1203 (2003).

    Article  CAS  Google Scholar 

  15. L.L. Duan, D.Q. Yu, S.Q. Han, J. Zhao, and L. Wang, 2004 Int. Conf. on Business Electronic Product Reliability and Liability (Piscataway, NJ: IEEE, 2004) pp. 35–41.

    Book  Google Scholar 

  16. P. Ratchev, B. Vandevelde, and I. De Wolf, IEEE Trans. Dev. Mater. Reliab. 4, 5 (2004).

    Article  CAS  Google Scholar 

  17. Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee, Proc. 2004 Int. IEEE Conf. on Asian Green Electronics (Piscataway, NJ: IEEE, 2004), pp. 177–181.

    Book  Google Scholar 

  18. C.S. Huang, J.G. Duh, Y.M. Chen, and J.H. Wang, J. Electron. Mater. 32, 89 (2003).

    Article  CAS  Google Scholar 

  19. Y.D. Jeon, O. Adreas, R. Herbert, and K.W. Paik, Proc. 53rd Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2003), pp. 1203–1208.

    Book  Google Scholar 

  20. C.E. Ho, Y.L. Lin, J.Y. Tsai, and C.R. Kao, J. Chin. Inst. Chem. Eng. 34, 387 (2003).

    CAS  Google Scholar 

  21. C.E. Ho, Y.L. Lin, and C.R. Kao, Chem. Mater. 14, 949 (2002).

    Article  CAS  Google Scholar 

  22. W.T. Chen, C.E. Ho, and C.R. Kao, J. Mater. Res. 17, 263 (2002).

    CAS  Google Scholar 

  23. C.E. Ho, L.C. Shiau, and C.R. Kao, J. Electron. Mater. 31, 1264 (2002).

    Article  CAS  Google Scholar 

  24. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 31, 584 (2002).

    Article  CAS  Google Scholar 

  25. L.C. Shiau, C.E. Ho, and C.R. Kao, Solder. Surf. Mount Technol. 14, 25 (2002).

    Article  CAS  Google Scholar 

  26. C.M. Liu, C.E. Ho, W.T. Chen, and C.R. Kao, J. Electron. Mater. 30, 1152 (2001).

    CAS  Google Scholar 

  27. C.E. Ho, W.T. Chen, and C.R. Kao, J. Electron. Mater. 30, 379 (2001).

    CAS  Google Scholar 

  28. C.E. Ho, R. Zheng, G.L. Luo, A.H. Lin, and C.R. Kao, J. Electron. Mater. 29, 1175 (2000).

    Article  CAS  Google Scholar 

  29. Y. Tian, C. Wang, and J. Gong, ICEPT 2003 Proc. 5th Int. Conf. on Electronic Packaging and Technology (Piscataway, NJ: IEEE, 2003), pp. 260–264.

    Book  Google Scholar 

  30. K.S. Kim, J.M. Yang, C.H. Yu, and H.J. Jeon, Mater. Trans. 45, 721 (2004).

    Article  CAS  Google Scholar 

  31. J.H. Lee, J.W. Park, D.H. Shin, and Y.S. Kim, J. Electron. Mater. 33, 28 (2004).

    CAS  Google Scholar 

  32. B.L. Young, J.G. Duh, and G.Y. Jang, J. Electron. Mater. 32, 1463 (2003).

    Article  CAS  Google Scholar 

  33. F. Zhang, M. Li, C.C. Chum, and C.H. Tung, J. Mater. Res. 18, 1333 (2003).

    CAS  Google Scholar 

  34. R.J.K. Wassink, Soldering in Electronics, 2nd ed. (British Isles, UK: Electrochemical Publications, 1989).

    Google Scholar 

  35. H.D. Blair, T. Pan, and J.A. Nicholson, Proc. 1998 IEEE Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 1998), pp. 259–267.

    Google Scholar 

  36. P.J. Kay and C.A. Mackay, Trans. Inst. Met. Finish 54, 68 (1976).

    Google Scholar 

  37. C.H. Lin, S.W. Chen, and C.H. Wang, J. Electron. Mater. 31, 907 (2002).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, National Central University, 320, Chulgli City, Taiwan

    C. M. Tsai, W. C. Luo, C. W. Chang, Y. C. Shieh & C. R. Kao

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  1. C. M. Tsai
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  2. W. C. Luo
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  3. C. W. Chang
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  4. Y. C. Shieh
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  5. C. R. Kao
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Tsai, C.M., Luo, W.C., Chang, C.W. et al. Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints. J. Electron. Mater. 33, 1424–1428 (2004). https://doi.org/10.1007/s11664-004-0082-1

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  • DOI: https://doi.org/10.1007/s11664-004-0082-1

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