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Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles

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Abstract

Miniaturization of electronic devices causes reliability issues in solder joints such as a reduction in mechanical, structural, and electrical properties. This work focuses on studying the effects of cobalt nanoparticle (NP) addition on the structural and mechanical properties of the Sn-58Bi solder joint. 0, 0.5, 1, and 2% Co NP added samples were prepared. The reflow process was done at 180 °C for 1 min. After the reflow process, all samples were aged at 70 °C for different periods of 0 h, 126 h, and 504 h. After the tensile test, the fractography was done using scanning electron microscopy (SEM). The result showed that after the addition of Co-nanoparticles, the grain size of Sn-58Bi was refined and significantly reduced for as reflowed samples. After thermal aging, the grain size was increased for all types of samples, while the increment in Sn-58Bi-0.5Co/1Co/2Co was controlled as compared to the Sn-58Bi solder joint.

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Acknowledgements

The author acknowledges the research support provided by the Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia.

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Authors and Affiliations

  1. National University of Sciences and Technology, Islamabad, Pakistan

    Hafiz Muhammad Saad & Muhammad Nasir Bashir

  2. Multi-Scale Fluid Dynamics Lab, Department of Mechanical Engineering, Yonsei University, Seoul, South Korea

    Muhammad Nasir Bashir

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  1. Hafiz Muhammad Saad
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Saad, H.M., Bashir, M.N. Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles. J Mater Sci: Mater Electron 34, 2235 (2023). https://doi.org/10.1007/s10854-023-11647-5

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