Abstract
Sn-Ag alloys are important solders, and Co and Co alloys are investigated as barrier layers. Interfacial reactions in Sn-Ag/Co couples were examined in this study for Ag contents of 1.0 wt.%, 2.0 wt.%, and 3.5 wt.% and reaction temperatures of 250°C, 200°C, and 150°C. Only CoSn3 formed in Sn-Ag/Co couples reacted at 250°C, but both CoSn3 and Ag3Sn formed in couples reacted at 200°C and 150°C. The reaction layer was 100 μm thick in Sn-3.5 wt.%Ag/Co couples reacted at 200°C for 110 h. The reaction rates were lower if Ag was added, but remained very fast compared with those for Ni and Ni-based substrates.
Similar content being viewed by others
References
R.J. Klein Wassink, Soldering in Electronics, 2nd ed. (Isle of Man: Electrochemical Publications, 1989).
S.K. Kang and A.K. Sarkhel, J. Electron. Mater. 23, 701–707 (1994).
S.W. Chen, C.H. Wang, S.K. Lin, and C.N. Chiu, J. Mater. Sci. Mater. Electron. 18, 19–37 (2007).
C. Chen, H.M. Tong, and K.N. Tu, Annu. Rev. Mater. Res. 40, 531–555 (2010).
C.M. Chen and S.W. Chen, J. Appl. Phys. 90, 1208–1214 (2001).
J.H. Lau, Microelectron. Int. 28, 8–22 (2011).
Council Directive, Off. J. Eur. Union L37, 19–23 (2003).
M.N. Chen, S.J. Ding, Q.Q. Sun, D.W. Zhang, and L.K. Wang, J. Electron. Mater. 37, 894–900 (2008).
S. Kumamoto, H. Sakurai, Y. Kukimoto, and K. Sugannuma, J. Electron. Mater. 37, 806–814 (2008).
T.Y. Lin, C.N. Liao, and A.T. Wu, J. Electron. Mater. 41, 153–158 (2012).
L. Maganin, V. Sirtori, S. Seregni, A. Origo, and P.L. Cavalloti, Electrochim. Acta 50, 4621–4625 (2005).
Y.H. Chao, S.W. Chen, C.H. Wang, and C.C. Chen, Metall. Mater. Trans. A 39A, 477–488 (2008).
C.H. Wang and C.Y. Kuo, J. Mater. Sci. 46, 2654–2661 (2011).
H.C. Pan and T.E. Hsieh, Mater. Sci. Eng. B 177, 61–68 (2012).
G. Chen, M.S. Dresselhaus, G. Dresselhaus, J.-P. Fleurial, and T. Caillat, Int. Mater. Rev. 48, 45–66 (2003).
G.J. Snyder and E.S. Toberer, Nat. Mater. 7, 105–114 (2008).
Z. Xiong, X. Chen, X. Huang, S. Bai, and L. Chen, Acta Mater. 58, 3995–4002 (2010).
S. Bhattacharya and R.C. Mallik, J. Electron. Mater. 40, 1221–1232 (2011).
W. Zhu, J. Wang, H. Liu, Z. Jin, and W. Gong, Mater. Sci. Eng. A 456, 109–113 (2007).
V.I. Franchuk, L.N. Larikov, E.A. Maksimenko, and P.V. Mudruk, Met. Phys. Adv. Technol. 16, 145–154 (1996).
D.H. Kim, M.G. Cho, S.-K. Seo, and H.M. Lee, J. Electron. Mater. 38, 39–45 (2009).
J. Chang, S.-K. Seo, M.G. Cho, D.N. Lee, K.-S. Kang, and H.M. Lee, J. Mater. Res. 27, 1877–1886 (2012).
M. He, Z. Chen, and G. Qi, Acta Mater. 52, 2047 (2004).
S.W. Chen, A.R. Zi, P.Y. Chen, H.S. Wu, Y.K. Chen, and C.H. Wang, Mater. Chem. Phys. 111, 17 (2008).
J.W. Yoon and S.B. Jung, Microelectron. Reliab. 46, 905 (2006).
M. He, Z. Chen, and G. Qi, Acta Mater. 52, 2047–2056 (2004).
D.R. Flandersf, E.G. Jacobs, and R.F. Pinizzotto, J.␣Electron. Mater. 26, 883–887 (1997).
Acknowledgement
The authors acknowledge the financial support of␣the National Science Council of Taiwan (NSC 97-2221-E-007-067-MY3).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Chen, Sw., Chen, TK., Chang, Js. et al. Interfacial Reactions in Sn-Ag/Co Couples. J. Electron. Mater. 43, 636–639 (2014). https://doi.org/10.1007/s11664-013-2927-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-013-2927-y