Abstract
How to prepare a high-k gate dielectric to replace SiO2 by a simple fabrication process compatible with standard CMOS technology is always a hot and difficult issue. In this work, high dielectric constants of 2919.5 at 100 Hz have been found in the non-stoichiometric TaOX thin film with abundant oxygen vacancies, which was deposited by using a mixed gas atmosphere with Ar of 20 SCCM and O of 2 SCCM. More impressively, the dielectric constants of TaOX thin film can be intentionally modulated by adjusting oxygen vacancy concentration, and the oxygen vacancy concentration of the TaOX thin film was controlled by choosing different oxygen atmosphere concentrations during chemical vapor deposition. Due to the polarization induced by oxygen vacancies, the dielectric constants of TaOX thin film was far higher than the dielectric constant of 29.4 of Ta2O5 thin film. This work demonstrates the possibility of obtaining the high dielectric response and adjusting the permittivity for metal oxide thin film.
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References
V. Naidu, S. Kotamraju, Mater. Sci. Forum 897, 571–574 (2017)
M.K. Bera, C. Mahata, C.K. Maiti, Thin Solid Films 517, 27–30 (2008)
L. Kang, B.H. Lee, W.J. Qi, Y. Jeon, R. Nieh, S. Gopalan, K. Onishi, J.C. Lee, Ieee Electron Device Lett. 21, 181–183 (2000)
J. Robertson, R.M. Wallace, Mater. Sci. Eng. R 88, 1–41 (2015)
M.C. Tsai, P.H. Cheng, M.H. Lee, H.C. Lin, M.J. Chen, J. Phys. D: Appl. Phys. 49, 265108 (2016)
J. Robertson, J. Vac. Sci. & Technol. B 18, 1785–1791 (2000)
K.J. Hubbard, D.G. Schlom, J. Mater. Res. 11, 2757–2776 (1996)
A. Singh, S. Chaudhury, C. Kumar Pandey, S. Madhulika Sharma, C. Kumar Sarkar, IET Circuits, Devices & Syst. 13, 1305–1310 (2019)
L. Huang, Y. Liu, X. Peng, J.K.O. Sin, Ieee Trans. Electron Devices 69, 690–695 (2022)
T. Guo, H. Wu, X. Su, Q. Guo, C. Liu, J. Alloys Compds. 871, 159116 (2021)
P. Han, T.C. Lai, M. Wang, X.R. Zhao, Y.Q. Cao, D. Wu, A.D. Li, Appl. Surf. Sci. 467–468, 423–427 (2019)
Y.Q. Wang, W.S. Hwang, G. Zhang, W.J. Yoo, Ieee Trans. Electron Devices 54, 2699–2705 (2007)
E.P. Gusev, M. Copel, E. Cartier, I.J.R. Baumvol, C. Krug, M.A. Gribelyuk, Appl Phys Lett 76, 176–178 (2000)
S.K. Kim, S.W. Lee, J.H. Han, B. Lee, S. Han, C.S. Hwang, Adv. Funct. Mater. 20, 2989–3003 (2010)
J.-J. Ma, Y. Gao, Y. Chen, M.-H. Wang, J. Mater. Sci. Mater. Electron. 33, 16915–16922 (2022)
C. Wang, G.Q. Mao, M. Huang, E. Huang, Z. Zhang, J. Yuan, W. Cheng, K.H. Xue, X. Wang, X. Miao, Adv. Sci. 9, 2201446 (2022)
T.H. Kim, S. Kim, B.G. Park, Microelectron. Eng. 237, 111498 (2021)
T.M. Pan, C.H. Lin, S.T. Pang, Ieee. Sens. J. 21, 2597–2603 (2021)
S.P. Swathi, S. Angappane, J. Sci.: Adv. Mater. Devices 6, 601–610 (2021)
B.K. Sahu, A. Das, Phys. E: Low-dimens. Syst. Nanostruct. 103, 60–65 (2018)
M. Zulfiqar, A. Zubair, T. Khan, N. Hua, S. Ilyas, A.M. Fashu, M.A. Afzal, R.K. Safeen, J. Mater. Sci. Mater. Electron. 32, 9463–9474 (2021)
M.J. Lee, C.B. Lee, D. Lee, S.R. Lee, M. Chang, J.H. Hur, Y.B. Kim, C.J. Kim, D.H. Seo, S. Seo, U.I. Chung, I.K. Yoo, K. Kim, Nat. Mater. 10, 625–630 (2011)
Z. Wang, M. Yin, T. Zhang, Y. Cai, Y. Wang, Y. Yang, R. Huang, Nanoscale 8, 14015–14022 (2016)
M. Muralidhar Singh, G. Vijaya, M.S. Krupashankara, B.K. Sridhara, T.N. Shridhar, Mater Today: Proc 5, 2696–2704 (2018)
D. Hu, J. Chen, W. Zhu, S. Huang, W. Chen, J. Wang, X. Wang, P. Xiao, Rev. Sci. Instrum. 92, 123906 (2021)
S.C. Jeon, Appl Sci 10, 3871 (2020)
D.B. Lee, J.H. Ko, J.H. Yi, J. Therm. Spray Technol. 14, 315–320 (2005)
N. Benito, C. Palacio, Appl. Surf. Sci. 351, 753–759 (2015)
M. Yao, J. Chen, Z. Su, Y. Peng, P. Zou, X. Yao, Acs Appl. Mater. & Interfaces 8, 11100–11107 (2016)
B. Arslan, S.O. Tan, H. Tecimer, Ş Altındal, J. Mater. Sci. Mater. Electron. 32, 26700–26708 (2021)
G.S. Oehrlein, F.M. d’Heurle, A. Reisman, J. Appl. Phys. 55, 3715–3725 (1984)
H.F. Zhang, B.Y. Ning, T.C. Weng, X.J. Ning, J. Am. Ceram. Soc. 104, 6413–6423 (2021)
W. Hu, Y. Liu, R.L. Withers, T.J. Frankcombe, L. Noren, A. Snashall, M. Kitchin, P. Smith, B. Gong, H. Chen, J. Schiemer, F. Brink, J. Wong-Leung, Nat. Mater. 12, 821–826 (2013)
Y.T. Chi, K.J. Van Vliet, M. Youssef, B. Yildiz, Adv. Sci. 9, 2104476 (2022)
A.Q. Jiang, L.D. Zhang, Phys. Rev. B 60, 9204–9207 (1999)
Acknowledgements
This work was supported by the Guangdong Science and Technology Plan (Grant No. 2022A0505020022), the youth project of Guangdong Foshan joint fund of Guangdong Natural Science Foundation (Grant No. 2020A1515110601), the Natural Science Foundation of China (Grant No. 62006042), and the youth project of Guangdong Foshan joint fund of Guangdong Natural Science Foundation (Grant No. 2019A1515110444).
Funding
This work was supported by the Guangdong Science and Technology Plan (Grant No. 2022A0505020022), the youth project of Guangdong Foshan joint fund of Guangdong Natural Science Foundation (Grant No. 2020A1515110601), the Natural Science Foundation of China (Grant No. 62006042), and the youth project of Guangdong Foshan joint fund of Guangdong Natural Science Foundation (Grant No. 2019A1515110444).
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Investigation, data curation, formal analysis and writing-original draft [QC]; Supervision [JC; GN]; Writing-review [SL; SZ]; Conceptualization [XW; WZ; XY and PX]; All authors read and approved the final manuscript.
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Cai, Q., Chen, J., Liu, S. et al. High dielectric response of TaOX thin film and its modification by controlling oxygen vacancy concentration. J Mater Sci: Mater Electron 34, 969 (2023). https://doi.org/10.1007/s10854-023-10419-5
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DOI: https://doi.org/10.1007/s10854-023-10419-5