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Stress Induced Degradation of High-k Gate Dielectric Ta2O5 Thin Films on Silicon

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The Physics of Semiconductor Devices (IWPSD 2017)

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Abstract

This work describes the influence of constant current stress induced degradation in reactively sputtered Ta2O5 thin film in pure argon and argon plus nitrogen within plasma. Capacitors were fabricated and the interface was characterized using I-V and C-V methods. X-ray diffraction (XRD) technique revealed the presence of N2 content in Ta2O5 films. A comparison between Ta2O5 films doped with and without N2 with respect to flat band shift and leakage current density is also presented. Post deposition annealing at 650° CreducesO/Ta ratio because of the formation of suboxides. It results in high quality TaOx film with high capacitance and low leakage current. On being stressed, flat band voltage in annealed devices shifts towards negative direction as a result positive charge traps are observed in high-k thin films. Incorporation of nitrogen in Ta2O5 dielectric films retain the intrinsic effect that significantly diminish the electron leakage current through deactivating the Vo (oxygen vacancy) related gap states.

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References

  1. S.H. Lo, D.A. Buchanan, Y. Taur, W. Wang, Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET’s. IEEE Electron Device Lett. 18(5), 209–211 (1997)

    Article  ADS  Google Scholar 

  2. G.D. Wilk, R.M. Wallace, J.M. Anthony, High-κ gate dielectrics: current status and materials properties considerations. J. Appl. Phys. 89(10), 5243–5275 (2001)

    Article  ADS  Google Scholar 

  3. R.M. Wallace, G.D. Wilk, High-κ dielectric materials for microelectronics. Crit. Rev. Solid State Mater. Sci. 28(4), 231–285 (2003)

    Article  ADS  Google Scholar 

  4. M. Houssa, M. Naili, V.V. Afanas’ev, M.M. Heyns, A. Stesmans, Electrical and physical characterization of high-k dielectric layers, in Proceedings of IEEE International Symposium on VLSI Technology, Systems, and Applications, pp. 196–199 (2001)

    Google Scholar 

  5. R.M. Wallace, G. Wilk, Alternative gate dielectrics for microelectronics. MRS Bull. 27(3), 186–191 (2002)

    Article  Google Scholar 

  6. S.P. Garg, N. Krishnamurthy, A. Awasthi, M. Venkatraman, The O–Ta (oxygen–tantalum) system. J. Phase Equilibria 17(1), 63–77 (1996)

    Article  Google Scholar 

  7. M.M. Howard, C.A. Ventrice, H. Geisler, D.A. Hite, P.T. Sprunger, Growth morphology and electronic structure of ultra-thin TaOx films on Ag (100), in MRS Online Proceedings Library Archive, vol. 623 (2000)

    Google Scholar 

  8. H. Sawada, K. Kawakami, Electronic structure of oxygen vacancy in Ta2O5. J. Appl. Phys. 86(2), 956–959 (1999)

    Article  ADS  Google Scholar 

  9. A.P. Huang, P.K. Chu, Improvement of interfacial and dielectric properties of sputtered Ta2O5 thin films by substrate biasing and the underlying mechanism. J. Appl. Phys. 97(11), 114106 (2005)

    Article  ADS  Google Scholar 

  10. E. Atanassova, A. Paskaleva, Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs. Microelectron. Reliab. 42(2), 157–173 (2002)

    Article  Google Scholar 

  11. E. Atanassova, D. Spassov, Hydrogen annealing effect on the properties of thermal Ta2O5 on Si. Microelectron. J. 30(3), 265–274 (1999)

    Article  Google Scholar 

  12. Y.S. Kim, M.Y. Sung, Y.H. Lee, B.K. Ju, M.H. Oh, The influence of surface roughness on the electric conduction process in amorphous Ta2O5 thin films. J. Electrochem. Soc. 146(9), 3398–3402 (1999)

    Article  Google Scholar 

  13. T. Hori, Gate Dielectric and MOS ULSI. Principles, Technologies and Applications. In Springer Series in Electronics and Photonics, vol. 34 (1997)

    Google Scholar 

  14. W.K. Choi, L.S. Tan, J.Y. Lim, S.G. Pek, Electrical characterisation of RF sputtered tantalum oxide films rapid thermal annealed with Ar, N2, O2 and N2O. Thin Solid Films 343, 105–107 (1999)

    Article  ADS  Google Scholar 

  15. K.H. Goh, H.J. Lee, S.K. Lau, P.C. Teh, S. Ramesh, C.Y. Tan, Y.H. Wong, Investigation of the effect of anodization time and annealing temperature on the physical properties of ZrO2 thin film on a Si substrate. Mater. Res. Express 4(8), 086414 (2017)

    Article  ADS  Google Scholar 

  16. S. Knebel et al. Reliability comparison of ZrO2 based DRAM High-k dielectrics under DC and AC Stress. IEEE Trans. Device Mater. Reliab. (2017)

    Google Scholar 

  17. H.E. Cheng, C.T. Mao, The effect of substrate temperature on the physical properties of tantalum oxide thin films grown by reactive radio-frequency sputtering. Mater. Res. Bull. 38(14), 1841–1849 (2003)

    Article  Google Scholar 

  18. E. Atanassova, A. Paskaleva, High temperature N/sub 2/annealing-a promising way for improving the structure of Ta/sub 2/O/sub 5/and its interface with Si, in 24th IEEE International Conference on Microelectronics, vol. 2 (2004), pp. 467–470

    Google Scholar 

  19. Y.S. Lai, K.J. Chen, J.S. Chen, Investigation of the interlayer characteristics of Ta2O5 thin films deposited on bare, N2O, and NH3 plasma nitridated Si substrates. J. Appl. Phys. 91(10), 6428–6434 (2002)

    Article  ADS  Google Scholar 

  20. U. Kashniyal, K.P. Pandey, Stress induced degradation and reliability of Al2O3 thin film on silicon. Vacuum 152, 109–113 (2018)

    Article  ADS  Google Scholar 

  21. E.H. Nicollian, J.R. Brews, MOS (Metal Oxide Semiconductor) Physics and Technology (Wiley, New York, 1982)

    Google Scholar 

  22. A. Rao, J. D’sa, S. Goyal, B.R. Singh, Conduction and field induced degradation in thin ZrO2 films sputtered in nitrogen containing plasma on silicon. J. Mater. Sci.: Mater. Electron. 25(3), 1583–1588 (2014)

    Google Scholar 

  23. N.K. Ponon, D.J.R. Appleby, E. Arac, P.J. King, S. Ganti, K.S.K. Kwa, A. O’Neill, Effect of deposition conditions and post deposition anneal on reactively sputtered titanium nitride thin films. Thin Solid Films 578, 31–37 (2015)

    Article  ADS  Google Scholar 

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Acknowledgements

Authors thank Prof. B. R. Singh, IIIT-Allahabad for his constant support and encouragement.

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Correspondence to Upendra Kashniyal .

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Kashniyal, U., Pandey, K.P. (2019). Stress Induced Degradation of High-k Gate Dielectric Ta2O5 Thin Films on Silicon. In: Sharma, R., Rawal, D. (eds) The Physics of Semiconductor Devices. IWPSD 2017. Springer Proceedings in Physics, vol 215. Springer, Cham. https://doi.org/10.1007/978-3-319-97604-4_92

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