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Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads

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Abstract

The shear performance and fracture behavior of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different substrate surface finishes (Cu with organic solderability preservatives and electroless Ni/immersion Au) combinations under electro-thermo-mechanical (ETM) coupled loads with increasing current density (from 1.0 × 103 to 6.0 × 103 A/cm2) were systematically investigated by experimental characterization, theoretical analysis, and finite element simulation. The results reveal that the shear strength varies slightly with different surface finish combinations, initially increasing and then decreasing as the current density is increased. Moreover, the increase in current density shifts the fracture location from the solder matrix to the interface between solder and intermetallic compound (IMC) layer, resulting in a ductile-to-brittle transition. The interfacial fracture is triggered by electric current crowding at the groove of the IMC layer and driven by the mismatch strain at the solder/IMC layer interface.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

Code availability

The codes are not publicly available as they also form part of an ongoing study.

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Funding

This research was funded by the National Natural Science Foundation of China under Grant No. 51805103, Natural Science Foundation of Guangxi Province under Grant No. 2018GXNSFBA281065, Science and Technology Planning Project of Guangxi Province under Grant No. GuiKeAD18281021, Director Fund Project of Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology No. 19-050-44-003Z, Self–Topic Fund of Engineering Research Center of Electronic Information Materials and Devices Nos. EIMD–AA202007 and EIMD–AB202005, and Innovation Project of Guangxi Graduate Education Nos. YCBZ2021068 and JGY2021084.

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Authors and Affiliations

  1. Engineering Research Center of Electronic Information Materials and Devices, Ministry of Education, Guilin University of Electronic Technology, Guilin, 541004, China

    Bo Wang, Wangyun Li & Kailin Pan

  2. Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, 541004, China

    Bo Wang, Wangyun Li & Kailin Pan

Authors
  1. Bo Wang
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  2. Wangyun Li
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  3. Kailin Pan
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Contributions

BW contributed to methodology, data curation, formal analysis, and writing and preparation of the original draft. WL contributed to conceptualization, methodology, formal analysis, writing, reviewing, and editing of the manuscript, and funding acquisition. KP contributed to funding acquisition, conceptualization, and writing, reviewing, and editing of the manuscript.

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Correspondence to Wangyun Li or Kailin Pan.

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Wang, B., Li, W. & Pan, K. Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads. J Mater Sci: Mater Electron 33, 4924–4939 (2022). https://doi.org/10.1007/s10854-021-07682-9

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