Abstract
The solidification behavior of two low-melting-point metals, Sn and In, on three substrates has been examined using in situ x-ray diffraction. Undercoolings of up to 56.1°C were observed for Sn solidified on graphite, which is a nonwetting substrate, while lower undercoolings were observed for Sn on Au/Ni/Cu (17.3°C) and on Cu (10.5°C). Indium behaved quite differently, showing undercoolings of less than 4°C on all three substrates. The lattice expansion/contraction behavior of Sn, In, and intermetallic compounds (IMCs) that formed during the reaction of Sn with Au/Ni/Cu surfaces were also measured during heating and cooling. Results showed anisotropic and nonlinear expansion of both Sn and In, with a contraction, rather than expansion, of the basal planes of In during heating. The principal IMC that formed between Sn and the Au/Ni/Cu surface was characterized as Cu6Sn5, having an average expansion coefficient of 13.6 × 10−6/°C, which is less than that of Sn or Cu.
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Acknowledgements
The authors would like to thank Mike Santella of Oak Ridge National Laboratory and Suresh Babu of the Ohio State University for assisting with the data analysis, and Jenia Karapetrova of the APS for assisting with the synchrotron beam-line setup and operation. This work was performed under the auspices of the US Department of Energy by Lawrence Livermore National Laboratory under Contract No. DE-AC52-07NA27344, and by Oak Ridge National Laboratory under Contract No. DE-AC05-00OR22725. The ORNL portion of this work was fully supported by the Materials Sciences and Engineering Division, Office of Basic Energy Sciences, US Department of Energy. The in situ synchrotron experiments were performed on 34-BM-C at the APS, which is supported by the US DOE, Basic Energy Sciences, Office of Science under Contract No. W-31-109-ENG-38.
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Open Access This is an open access article distributed under the terms of the Creative Commons Attribution Noncommercial License (https://creativecommons.org/licenses/by-nc/2.0), which permits any noncommercial use, distribution, and reproduction in any medium, provided the original author(s) and source are credited.
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Elmer, J.W., Specht, E.D. Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction. J. Electron. Mater. 40, 201–212 (2011). https://doi.org/10.1007/s11664-010-1438-3
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DOI: https://doi.org/10.1007/s11664-010-1438-3