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Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density

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Abstract

In this study, the shear performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density were systematically investigated by experimental characterization, theoretical analysis, and finite element simulation. The results showed that the shear strength of the solder joint decreased with increasing current density, while it increased with decreasing joint height. These changes were mainly due to Joule heating, the non-thermal effect of current stressing, and mechanical constraint in the solder joint. As current density increased, both Joule heating and the non-thermal effect of current stressing aggravated solder joint shear strength more and more severely. At the same current density, Joule heating’s deterioration on the shear strength was less serious in the smaller height joint, and the non-thermal effect was insensitive to the change in joint height. The higher shear strength of the smaller height joint was due to the larger mechanical constraint in the solder matrix induced by the substrate. Moreover, as current density increased, the fracture position changed from the solder matrix to the solder/IMC layer interface. The fracture mode shifted from ductile one to ductile–brittle-mixed one, and the critical current density corresponding to the fracture mode transition increased with decreasing joint height. The above findings indicate that the BGA structure solder joint with a smaller joint height is more reliable.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

Code availability

The codes are not publicly available as they also form part of an ongoing study.

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Funding

We thank the support by the National Natural Science Foundation of China under Grant Nos. 52065015 and 51805103, Director Fund Project of Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology No. 20–065-40-003Z, Science and Technology Plan Project of Liudong New District under Grant No. Liudongkegong20210106, Innovation Project of GUET Graduate Education Nos. YCSW2021184 and 2022YCXS001, and Innovation Project of Guangxi Graduate Education No. JGY2021084.

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, 541004, China

    Yubing Gong, Longgen Liu, Siliang He, Wangyun Li & Hongbo Qin

  2. ZJU-Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University, Hangzhou, 310058, China

    Haidong Yan

Authors
  1. Yubing Gong
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  2. Longgen Liu
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  3. Siliang He
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  4. Haidong Yan
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  5. Wangyun Li
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  6. Hongbo Qin
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Contributions

YG contributed to investigation, methodology, formal analysis, data curation, and writing of the original draft. LL contributed to investigation, methodology, formal analysis, data curation, and writing of the original draft. HY contributed to conceptualization and formal analysis. SH contributed to writing, reviewing, & editing of the manuscript. WL contributed to conceptualization, methodology, formal analysis, data curation, and writing, reviewing, & editing of the manuscript. HQ contributed to conceptualization, methodology, and writing, reviewing, & editing of the manuscript.

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Correspondence to Wangyun Li or Hongbo Qin.

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Gong, Y., Liu, L., He, S. et al. Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density. J Mater Sci: Mater Electron 33, 24906–24919 (2022). https://doi.org/10.1007/s10854-022-09200-x

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