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Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

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Abstract

In this paper, different mass fractions (0, 0.01, 0.03, 0.05, 0.07, and 0.09 wt.%) of graphene nanosheets (GNSs) were selected as a strengthening phase to promote the performances of Sn/Cu solder joint. The wettability and shear performance of Sn-xGNSs/Cu solder and the growth behavior of intermetallic compound (IMC) during solid–liquid diffusion at 250 °C and under multiple reflows (1, 2, 4, and 8 times) were systematically discussed. Results exhibited that the wettability of GNSs doped solder improved as GNSs added and 0.05% GNSs addition would promote the spreading area of the composite solder effectively. The scalloped Cu6Sn5 IMC layer was formed at the interfacial Sn-xGNSs/Cu. Based on the adsorption theory, GNSs doping was conducive to prohibiting the interfacial IMC growth of Sn solder reinforced with GNSs during soldering process and reflowing process. Meanwhile, the IMC overtly became thinner in Sn-0.05GNSs solder with comparison to plain solder. What’s more, GNSs addition brought about an enhancement in the mechanical performance of GNS-containing solder. The fracture surface of solder joint after doping GNSs transformed from a brittle pattern to a ductile pattern.

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References

  1. G. Chen, F.S. Wu, C.Q. Liu et al., Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. J. Alloy. Compd. 656, 500–509 (2016)

    Article  CAS  Google Scholar 

  2. Y.S. Yang, C.J. Yang, F.Y. Ouyang, Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration. J. Alloy. Compd. 674, 331–340 (2016)

    Article  CAS  Google Scholar 

  3. M.Y. Xiong, L. Zhang, L. Sun et al., Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints. Vacuum 167, 301–306 (2019)

    Article  CAS  Google Scholar 

  4. A. Nabihah, M.S. Nurulakmal, Effect of In addition on microstructure, wettability and strength of SnCu solder. Mater. Today Proc. 17, 803–809 (2019)

    Article  CAS  Google Scholar 

  5. W.Q. Xing, X.Y. Yu, H. Li et al., Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0-1) lead-free solder alloy: first-principles calculation and experimental research. Mater. Sci. Eng. A 678, 252–259 (2016)

    Article  CAS  Google Scholar 

  6. Y.C. Wang, C.J. Fleshman, R.W. Song et al., Diversifying grain orientation and expediting 10 μm Cu/Sn/Cu TLP bonding process with Ni doping. J. Mater. Sci. Mater. Electron. 32, 2639–2646 (2021)

    Article  CAS  Google Scholar 

  7. W.J. Plumbridge, Tin pest issues in lead-free electronic solders. J. Mater. Sci. Mater. Electron. 18, 307–318 (2007)

    Article  CAS  Google Scholar 

  8. Y.W. Wang, T.L. Yang, J.Y. Wu et al., Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications. J. Alloy. Compd. 750, 570–576 (2018)

    Article  CAS  Google Scholar 

  9. L. Sun, M.H. Chen, L. Zhang et al., Effect of addition of CuZnAl particle on the properties of Sn solder joint. J. Mater. Process. Technol. 278, 116507 (2019)

    Article  CAS  Google Scholar 

  10. G.Q. Wei, L.C. Du, Y.P. Jia et al., Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints. J. Mater. Sci. Mater. Electron. 26(6), 4313–4317 (2015)

    Article  CAS  Google Scholar 

  11. Y. Ma, X.Z. Li, L.Z. Yang et al., Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging. Mater. Sci. Eng. A 696, 437–444 (2017)

    Article  CAS  Google Scholar 

  12. W.C. Yang, L. Yang, X.J. Zhang et al., Influence of graphene nanosheets addition on the microstructure, wettability, and mechanical properties of Sn-0.7Cu solder alloy. J. Mater. Sci. Mater. Electron. 31(17), 14035–14046 (2020)

    Article  CAS  Google Scholar 

  13. H.G. Wang, K.K. Zhang, M. Zhang, Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder. J. Alloy. Compd. 781, 761–772 (2019)

    Article  CAS  Google Scholar 

  14. X. Hu, Y.C. Chan, K.L. Zhang et al., Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis. J. Alloy. Compd. 580, 162–171 (2013)

    Article  CAS  Google Scholar 

  15. D.L. Ma, P. Wu, Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets. J. Alloys Compd. 671, 127–136 (2016)

    Article  CAS  Google Scholar 

  16. R. Mayappan, A. Salleh, Intermetallic growth retardation with the addition of graphene in the Sn-3.5Ag lead-free solder. IOP Conf. 205, 012017 (2017)

    Google Scholar 

  17. Y. Ma, X.Z. Li, W. Zhou et al., Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder. Mater. Des. 113, 264–272 (2017)

    Article  CAS  Google Scholar 

  18. N. Jiang, L. Zhang, K.K. Xu et al., Study on the reliability of graphene nanosheets-reinforced Sn-58Bi/Cu solder joints. Rare Metal Mater. Eng. 49(03), 403–410 (2020)

    Google Scholar 

  19. Y.L. Huang, Z.Y. Xiu, G.H. Wu et al., Sn–3.0Ag–0.5Cu nanocomposite solders reinforced by graphene nanosheets. J. Mater. Sci. Mater. Electron. 27(7), 6809–6815 (2016)

    Article  CAS  Google Scholar 

  20. L.M. Yin, Z.W. Zhang, Z.L. Su et al., Effects of graphene nanosheets on the wettability and mechanical properties of Sn-0.3Ag-0.7Cu lead-free solder. J. Electron. Mater. 49(12), 1–6 (2020)

    Article  CAS  Google Scholar 

  21. Y.L. Huang, Z.Y. Xiu, G.H. Wu et al., Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets. Mater. Lett. 169, 262–264 (2016)

    Article  CAS  Google Scholar 

  22. M.S. Kang, D.S. Kim, Y.E. Shin, Suppression of the growth of intermetallic compound layers with the addition of graphene nano-sheets to an epoxy Sn–Ag–Cu Solder on a Cu substrate. Materials 12(6), 936 (2019)

    Article  CAS  Google Scholar 

  23. Cao Q T, Zhao H L, Xu L Y, et al. Effects of graphene nanosheets on the intermetallic compounds layer between Sn-Ag-Cu lead-free solders and Cu substrates[C]//2015 Asia-Pacific Microwave Conference. IEEE, 2015.

  24. L.Y. Xu, Z.K. Zhang, H.Y. Jing et al., Effect of graphene nanosheets on the corrosion behavior of Sn-Ag-Cu solders. J. Mater. Sci. Mater. Electron. 26(8), 5625–5634 (2015)

    Article  CAS  Google Scholar 

  25. X.D. Liu, Y.D. Han, H.Y. Jing et al., Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder. Mater. Sci. Eng. A 562, 25–32 (2013)

    Article  CAS  Google Scholar 

  26. W.C. Yang, Z.J. Yang, Y.K. Fu et al., Effect of graphene nanosheet addition on the wettability and mechanical properties of Sn-20Bi-xGNS/Cu solder joints. Materials 13(18), 3968 (2020)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

The present work was under support of the Key project of State Key Laboratory of Advanced Welding and Joining (Grant No. AWJ-19Z04), National Key Research and Development Project (Grant No. 2019YFF0217400), Central Plains Science and Technology Innovation Talent Plan (Grant No. ZYQR20180030), and Postgraduate Research & Practice Innovation Program of Jiangsu Normal University (Grant No. 2020XKT186).

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Authors and Affiliations

  1. School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Mu-lan Li, Liang Zhang & Nan Jiang

  2. Shanghai Institute of Radio Equipment, Shanghai, 200090, China

    Li-li Gao

  3. State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, 450001, China

    Liang Zhang, Su-juan Zhong & Lei Zhang

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  1. Mu-lan Li
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  2. Li-li Gao
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Correspondence to Liang Zhang.

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Li, Ml., Gao, Ll., Zhang, L. et al. Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing. J Mater Sci: Mater Electron 32, 26666–26675 (2021). https://doi.org/10.1007/s10854-021-07044-5

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  • DOI: https://doi.org/10.1007/s10854-021-07044-5

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