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Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

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Abstract

Polarized light microscopy and electron backscatter diffraction have been used to quantify the number of β-Sn grains and to examine the Sn crystallographic orientation in Sn–Ag–Cu/Cu solder joints, respectively. The effect of solder joint size on the Sn grain features was investigated due to the miniaturization of solder joints. The Sn–Ag–Cu solder joints of different sizes were found to contain only several β-Sn crystal grains and most solder joints were comprised of no more than three Sn grains. The solder joints showed a preferred crystal orientation. The c crystal axis of β-Sn grains tended to be at a small angle with solder pads. Specific orientation relationships were observed to be prevalent between neighboring β-Sn grains. The grain number, crystal orientation and misorientation were independent of solder joint size.

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Abbreviations

EBSD:

Electron backscatter diffraction

PLM:

Polarized light microscopy

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Acknowledgments

The work was financially supported by the National Natural Science Foundation of China under grant No. 50675047 and Joint Project between Samsung Electronics Co. Ltd. (Korea) and Harbin Institute of Technology (HIT).

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Authors and Affiliations

  1. Department Electronics Packaging Technology, Harbin Institute of Technology, 92 West Dazhi Street, 150001, Harbin, Peoples’ Republic of China

    Shihua Yang & Yanhong Tian

  2. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, 92 West Dazhi Street, 150001, Harbin, Peoples’ Republic of China

    Chunqing Wang

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  1. Shihua Yang
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  2. Yanhong Tian
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Correspondence to Shihua Yang.

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Yang, S., Tian, Y. & Wang, C. Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes. J Mater Sci: Mater Electron 21, 1174–1180 (2010). https://doi.org/10.1007/s10854-009-0042-x

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  • DOI: https://doi.org/10.1007/s10854-009-0042-x

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