A large number of lead-free Sn-Ag-Cu controlled collapse chip connection (C4) solder joints (∼100 μm in diameter) in flip-chip microelectronic packages were studied by electron backscatter diffraction (EBSD) in order to describe the statistical distribution of grain size and coincident site lattice boundaries associated with 60 deg twins in the Sn phase, as a function of silver content. It is shown that lower silver content results in smaller grains, and a lower propensity for grains to exhibit twinning symmetries. Indirect measurements of the creep properties of these joints were also obtained as a function of silver content, showing that, in the strain rate and temperature conditions that are the most relevant to the microelectronic industry, solder joints with low silver content are more susceptible to creep deformation.
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Acknowledgements
The authors are grateful to Donald W. Henderson for sharing his vast expertise on the subject, in particular on models for the influence of Ag on the creep behavior. The authors also acknowledge the careful review of this manuscript by Brian R. Sundlof, David Danovitch, and Peter Brofman. This work was partially accomplished using the facilities at Hydro-Quebec, with the help of Pierre Hovington.
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Open Access This is an open access article distributed under the terms of the Creative Commons Attribution Noncommercial License ( https://creativecommons.org/licenses/by-nc/2.0 ), which permits any noncommercial use, distribution, and reproduction in any medium, provided the original author(s) and source are credited.
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Sylvestre, J., Blander, A. Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints. J. Electron. Mater. 37, 1618–1623 (2008). https://doi.org/10.1007/s11664-008-0509-1
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DOI: https://doi.org/10.1007/s11664-008-0509-1