Abstract
Rising concern over the use of lead in industry provides a driving force for the development of improved lead-free industrial materials. Therefore, a new lead-free base solder alloy Sn-4.7Agl.7Cu (wt.%) has been developed upon which a family of lead-free solders can be based. This solder alloy exhibits a ternary eutectic reaction at 216.8 ± 1°C (L ↠ η+ ϕ + β-Sn; η = Cu6Sn5, θ = Ag3Sn). Preliminary tests of solderability demonstrate intermetallic phase formation on model solder joint interfaces and good wettability in a fluxed condition suggest technological viability and motivates much more extensive study of this solder alloy.
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Miller, C.M., Anderson, I.E. & Smith, J.F. A viable tin-lead solder substitute: Sn-Ag-Cu. J. Electron. Mater. 23, 595–601 (1994). https://doi.org/10.1007/BF02653344
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DOI: https://doi.org/10.1007/BF02653344