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Bio-based trifunctional diphenolic acid epoxy resin with high Tg and low expansion coefficient: synthesis and properties

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Abstract

Nowadays, the rapid development of industrial technology is putting a great demand for high-performance epoxy resin. Traditional bisphenol A epoxy resin (DGEBA) is facing great challenges from both the perspective of human health and the needs of cost reduction under the background of oil resources shortage. Therefore, it’s important to find appropriate substitutes for DGEBA. In this paper, a trifunctional epoxy resin (DPA-E) was prepared using a simple two-step method with diphenolic acid and epichlorohydrin. It was interesting that the DPA-E, cured by 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane (DMDC), showed the similar properties as DGEBA except for curing temperature, glass transition temperature, and thermal expansion properties. The gel temperature for DPA-E/DMDC was as low as 29 ℃, which was obtained from curing kinetic study. Even for curing temperature of DPA-E/DMDC was also relatively low (Tp = 83 ℃). Even so, the glass transition temperature of this system was as high as 239 ℃, which was 24% higher than that of DGEBA/DMDC (Tg = 193 ℃). Furthermore, DPA-E/DMDC showed a lower thermal expansion coefficient, especially at elevated temperature (> 150 ℃). Therefore, this kind of new epoxy resin might have a very hopeful future in many important areas including aerospace and microelectronics.

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Acknowledgements

This work is supported by National Nature Science Foundation of China (NSFC, 51903016), China Postdoctoral Science Foundation (2021M693917), Central University Basic Research Fund of China (300102310202) and National College Students Innovation and Entrepreneurship Training Program (202110710100).

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Authors and Affiliations

  1. Institute of Polymer Materials, School of Materials Science and Engineering, Chang’an University, Xi’an, 710064, Shaanxi, People’s Republic of China

    Junji Wei, Yajun Duan, Hao Wang & Jiamin Qi

  2. School of Construction Machinery, Chang’an University, Xi’an,, 710064, Shaanxi, People’s Republic of China

    Jizhuang Hui

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  1. Junji Wei
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  2. Yajun Duan
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  3. Hao Wang
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Correspondence to Junji Wei.

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Wei, J., Duan, Y., Wang, H. et al. Bio-based trifunctional diphenolic acid epoxy resin with high Tg and low expansion coefficient: synthesis and properties. Polym. Bull. 80, 10457–10471 (2023). https://doi.org/10.1007/s00289-022-04570-y

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  • DOI: https://doi.org/10.1007/s00289-022-04570-y

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