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Bonding characteristics of adhesive/particle joints

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Summary

The bonding characteristics of adhesive/substrate was investigated using IR spectroscopic technique. Delignified saw-dust was employed as wood substrate. A bond linkage of\(C - O - C\) type with significant absorption at 1150 cm−1 wave number was observed. The absence of absorption at 1420 cm−1 showed the consumption of phenolic hydroxyl group in the\(C - O - C\) bond formation. Chemisorption constant of

$$log k = - 2.42$$

was observed and a chemisorption isotherm of

$$y = 0.0038x + 0.38$$

with a weak positive correlation coefficient was established.

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Authors and Affiliations

  1. Chemical Sciences Department, Ogun State University, P.M.B. 2002, Ago-Iwoye, Nigeria

    E. A. Taiwo

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  1. E. A. Taiwo
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The author acknowledges the assistance of Otuwa, D. T. in running the Infrared spectra

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Taiwo, E.A. Bonding characteristics of adhesive/particle joints. Wood Sci.Technol. 31, 303–309 (1997). https://doi.org/10.1007/BF00702617

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  • DOI: https://doi.org/10.1007/BF00702617

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