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Ceramic joining

Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers

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Abstract

A method of ceramic-ceramic joining that exploits a thin layer of a transient liquid phase to join alumina to alumina has been developed, and the results of its application to joining alumina are reported. Through the use of microdesigned multilayer Cu/Pt interlayers, transient liquid-phase joining has been achieved at 1150°C, yielding an interlayer that is platinum-rich at temperatures substantially lower than those required for solid-state diffusion bonding with pure platinum interlayers. Flexure tests indicate that ceramic/metal interface strengths exceeding those of the ceramic can be achieved. Post-bonding anneals of 10 h duration in air and gettered argon at 1000 °C had discernibly different effects on room-temperature joint strength. The microstructure and chemistry of fracture surfaces were examined using SEM and EDS in an effort to identify the nature of strength-limiting flaws in both as-bonded and postbonding annealed specimens. Topics requiring further study are identified. Opportunities for extensions of the method to other systems are discussed.

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Authors and Affiliations

  1. Center for Advanced Materials, Lawrence Berkeley Laboratory, and Department of Materials Science and Mineral Engineering, University of California, 94720, Berkeley, CA, USA

    M. L. Shalz, B. J. Dalgleish, A. P. Tomsia & A. M. Glaeser

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  1. M. L. Shalz
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  2. B. J. Dalgleish
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  3. A. P. Tomsia
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  4. A. M. Glaeser
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Shalz, M.L., Dalgleish, B.J., Tomsia, A.P. et al. Ceramic joining. Journal of Materials Science 28, 1673–1684 (1993). https://doi.org/10.1007/BF00363367

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