Abstract
Bonding between copper and alumina can be obtained by the “solid state bonding” process and the “liquid phase bonding” process. The strength of interfaces has been tested mechanically using shear tests, tensile tests and fracture toughness tests. The effects of bonding parameters on bond strength have been studied. Observations by transmisssion electron microscopy have been performed to detect and analyse the nature and evolution of interfacial compounds as a function of copper oxidation and bonding time. Chemical reactions lead to the formation of the binary oxide CuAlO2. The stability of this compound and the reversibility of chemical reactions appear to be very dependent on the amount of oxygen present in the system.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
J. T. Klomp, Sci. Ceram. 5 (1970) 501.
Idem, Bull. Amer. Ceram. Soc. 51 (1972) 683.
C. A. M. Mulder and J. T. Klomp, J. de Phys. 46 (1985) 111.
M. Turwitt, G. Elssner and G. Petzow, ibid. 46 (1985) 123.
T. E. O'Brian and A. C. D. Chaklader, J. Amer. Ceram. Soc. 57 (1974) 329.
N. Eustathopoulos and A. Passerone, in Proceedings of the 7th International Steelmaking Days, 1978, Versailles, France.
J. Pask and A. Tomsia, in “Surfaces and Interfaces in Ceramic and Ceramic-Metal Systems”, edited by J. Pask and A. Evans (Plenum, New York, 1981) p. 411.
G. Heimke and G. Heidt, Ber. Dt Keram. Ges. 50 (1973) 303.
H. Schmidt-Brucken and W. Schlapp, Keramische Zeitschrift 23 (1971) 278.
J. F. Burgess, C. A. Neugebauer and G. Flanagan, J. Electrochem. Soc. 122 (1975) 688.
M. Hansen and K. Anderko, “Constitution of Binary Alloys”, (McGraw Hill, New York, 1958).
M. Courbiere, Thèse ECL, 1986.
G. Honjo, J. Phys. Soc. Jpn 8 (1953) 113.
M. Courbiere, D. Treheux, C. Beraud, C. Esnouf, G. Thollet and G. Fantozzi, J. de Phys. C1 (1986) 18.
R. F. Pabst and G. Elssner, J. Mater. Sci. 15 (1980) 188.
J. T. Klomp, “Science of Ceramics”, edited by C. Brosset and E. Knoop (Gothenberg Swedish Institute for Silicate, 1970).
A. Wicker, P. Darbon and F. Grivon, in Proceedings of International Symposium on Ceramic Compounds for Engine, Japan, 1983, p. 716.
S. Dushman, Scientific Foundation of “Vacuum Technic” (Wiley & Son, 1962).
K. J. Jacob and C. B. Alcock, J. Amer. Ceram. Soc. 58 (1975) 192.
C. Beraud, Thèse INSA, 1986.
J. H. Ho and R. W. Vook, Phil. Mag. 36 (1977) 1051.
D. A. Goulden, Phil. Mag. 33 (1976) 393.
I. Okamoto, A. Ohmori and M. Kubo, Trans. of JWRI 8 (1982) 123.
J. F. Dickson, Int. J. Hybrid. Micro. 5 (1982) 103.
J. Benard, in “L'oxydation des métaux”, edited by Gauthier-Villars and Cie, Vol. 1, (Paris, 1962) pp. 284–285.
D. Hanson, C. Marryat and G. W. Ford, J. Inst. Met. 3 (1923) 197.
C. Beraud, G. Thollet, M. Courbiere and C. Esnouf, Colloque S.F.M.E., Strasbourg (1985).
M. Courbiere, R. Trabelsi, D. Treheux, C. Beraud, C. Esnouf and G. Fantozzi, in “High Tech Ceramics”, edited by P. Vincenzini, (Elsevier, Amsterdam, 1987) pp. 2599–2608.
T. Ishuguro, N. Ishizawa, N. Mizutani and M. Kato, J. Solid State Chem. 41 (1982) 132.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Beraud, C., Courbiere, M., Esnouf, C. et al. Study of copper-alumina bonding. J Mater Sci 24, 4545–4554 (1989). https://doi.org/10.1007/BF00544543
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF00544543