Abstract
Cylinders of copper and nickel have been melted under various conditions to form sessile drops on alumina plaques. The resultant metal/ceramic adhesion at room temperature has been measured using the commonly adopted test in which the drops are pushed off the ceramic plaques. The stress system involved in the test has been analysed and it has been shown that the standard interpretation of the test, as a measure of interfacial shear strength, is not valid; the revised interpretation makes it a measure of adhesion in tension. Results for the Cu/Al2O3 and Ni/Al2O3 systems show that non-wetted interfaces can be strong and have strengths that are independent of contact-angle changes caused by wetting-temperature variations.
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Nicholas, M., Forgan, R.R.D. & Poole, D.M. The adhesion of metal/alumina interfaces. J Mater Sci 3, 9–14 (1968). https://doi.org/10.1007/BF00550883
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DOI: https://doi.org/10.1007/BF00550883