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Properties of (Fe–B)-doped Sn–1.0Ag–0.5Cu solders prepared by mechanical alloying

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Abstract

To introduce boron (B) into the Sn–1.0Ag–0.5Cu (SAC105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn–Fe–B master alloys were prepared by mechanical alloying initially; then, the SAC105-0.05(Fe–B) and SAC105-0.1(Fe–B) solder alloys were prepared using 72-h-milling Sn–Fe–B master alloys. The preparation process and the properties of solders were studied in this work. For the Sn–Fe–B master alloys, the results show that with the increase in the ball-milling time, the powder changes illustrate a cold welding–crushing–cold welding cyclic process. Moreover, the supersaturated solid solubility of (Fe–B) increases gradually in the alloys’ matrix and the lattice distortion increases to 0.167% after 72-h milling. Meanwhile, the alloying degree is increasingly apparent, and after 72-h milling, the content of B in the Sn matrix reaches 2.38 wt%. For the solder alloys, with the (Fe–B) content increasing, the melting point decreases and a significant grain refinement occurs in the matrix. Compared to the benchmark SAC105, the hardness of SAC105-0.05(Fe–B) and SAC105-0.1(Fe–B) solder alloys prepared by this method is improved by 20.65% and 34.79%, respectively. The present research provides a novel approach for introducing the immiscible component into the lead-free solder alloys.

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References

  1. Abtew M, Selvaduray G. Lead-free Solders in Microelectronics. Mater Sci Eng R. 2000;27(5):95.

    Article  Google Scholar 

  2. Mustafa M, Suhling JC, Lall P. Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. Microelectron Reliab. 2016;56:136.

    Article  CAS  Google Scholar 

  3. Zou CD, Gao YL, Yang B, Xia XZ, Zhai QJ, Andersson C, Liu J. Nanoparticles of the lead-free solder alloy Sn–3.0Ag–0.5Cu with large melting temperature depression. J Electron Mater. 2009;38(2):351.

    Article  CAS  Google Scholar 

  4. Wang Y, Zhao XC, Liu Y, Wang Y, Li DM. Microstructure, wetting property of Sn–Ag–Cu–Bi–xCe solder and IMC growth at solder/Cu interface during thermal cycling. Rare Met. 2015. https://doi.org/10.1007/s12598-015-0526-1.

    Article  Google Scholar 

  5. Sui YW, Sun R, Qi JQ, He YZ, Wei FX, Meng QK, Sun Z. Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate. Rare Met. 2017. https://doi.org/10.1007/s12598-017-0968-8.

    Article  Google Scholar 

  6. Qu JF, Xu J, Hu Q, Zhang FW, Zhang SM. Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron. Rare Met. 2015;34(11):783.

    Article  CAS  Google Scholar 

  7. Sun L, Chen M, Zhang L, Yang F. Microstructures evolution and properties of Sn–Ag–Cu solder joints. Acta Metall Sin. 2017;53(5):615.

    CAS  Google Scholar 

  8. Mahdavifard MH, Sabri MFMM, Shnawah DA, Said SM, Badruddin IA, Rozali S. The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy. Microelectron Reliab. 2015;55(9–10):1886.

    Article  CAS  Google Scholar 

  9. Choi H, Lee TK, Kim Y, Kwon H, Tseng CF, Duh JG, Choe H. Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions. Intermetallics. 2012;20(1):155.

    Article  CAS  Google Scholar 

  10. Ye L, Lai ZH, Liu J, Thölén A. Microstructure investigation of Sn–0.5Cu–3.5Ag and Sn–3.5Ag–0.5Cu–0.5B lead-free solders. Solder Surf Mt Technol. 2001;13(3):16.

    Article  CAS  Google Scholar 

  11. Wang RD, Zhang SM, Hu Q, Zhang FW. Effect of boron on microstructure and properties of Sn–1.0Ag–0.5Cu low-silver lead-free solder. Mater Sci Forum. 2017;898:908.

    Article  Google Scholar 

  12. Suryanarayana C. Mechanical alloying and milling. Prog Mater Sci. 2001;46(1):1.

    Article  CAS  Google Scholar 

  13. Weeber AW, Bakker H. Amorphization by ball milling. A review. Phys B Phys Condens Matter. 1988;153(1):93.

    Article  CAS  Google Scholar 

  14. Wu ZF, Wu J, Zhang L, Liu C, Wu R. Solid solubility extension of copper-tin immiscible system during mechanical alloying. Materialwiss Werkstofftech. 2018;49(1):54.

    Article  CAS  Google Scholar 

  15. Shingu PH, Ishihara KN. Non-equilibrium materials by mechanical alloying (overview). Mater Trans JIM. 1995;36(2):96.

    Article  CAS  Google Scholar 

  16. Miedema AR, De Châtel PF, De Boer FR. Cohesion in alloys—fundamentals of a semi-empirical model. Physica B + C. 1980;100(1):1.

    Article  CAS  Google Scholar 

  17. De Boer FR, Mattens WCM, Boom R, Miedema AR, Niessen AK, De Boer FR, Mattens WCM, Boom R. Cohesion in Metals[J]. 1988.

  18. Dębski A, Dębski R, Gasior W. New features of Entall database: comparison of experimental and model formation enthalpies. Arch Metall Mater. 2014;59(4):1337.

    Article  Google Scholar 

  19. Zhang RF, Rajan K. Statistically based assessment of formation enthalpy for intermetallic compounds. Chem Phys Lett. 2014;612:177.

    Article  CAS  Google Scholar 

  20. Chen ZH, Chen D. Mechanical alloying and solid–liquid reaction ball milling. Beijing: Chemical Industry Press; 2006. 34.

    Google Scholar 

  21. Ma E, Sheng HW, He JH, Schilling PJ. Solid-state alloying in nanostructured binary systems with positive heat of mixing. Mater Sci Eng A. 2000;286(1):48.

    Article  Google Scholar 

  22. Yavari AR, Desré PJ. Thermodynamics and kinetics of amorphisation during mechanical alloying[C]//Materials Science Forum. Trans Tech Publications. 1992; 88: 43.

    Google Scholar 

  23. Yamane T, Okubo H, Oki N, Hisayuki K, Konishi M, Minamino Y, Koizumi Y, Kiritani M, Komatsu M, Kin SJ. Impact consolidation of mixed copper and carbon powders mechanically alloyed. J Jpn Soc Powder Powder Metall. 2009;48(1):9.

    Article  Google Scholar 

  24. Wei ZQ, Xia TD, Wang J, Wu ZG, Yan PX. Lattice expansion of Ni nanopowders. Acta Phys Sin. 2007;56(2):1004.

    CAS  Google Scholar 

  25. Lü L, Lai MO. Mechanical Alloying. Boston: Springer; 1998. 166.

    Book  Google Scholar 

  26. Li L, Wang W, Hu L, Ying R, Wei B. Lattice properties of supersaturated Ni–Sn solid solutions. Mater Lett. 2015;160:72.

    Article  CAS  Google Scholar 

  27. Yao ZH. Research on properties and microstructure of 12Cr-ODS Fe-based superalloy fabricated by mechanical alloying. Wuhan: Huazhong University of Science & Technology; 2011. 32.

    Google Scholar 

  28. Nouri A, Hodgson PD, Wen C. Effect of ball-milling time on the structural characteristics of biomedical porous Ti–Sn–Nb alloy. Mater Sci Eng C. 2011;31(5):921.

    Article  CAS  Google Scholar 

  29. Liu X, Wu Y, Bian X. The nucleation sites of primary Si in Al–Si alloys after addition of boron and phosphorus. J Alloys Compd. 2005;391(1):90.

    Article  CAS  Google Scholar 

  30. Zhuang HS. New development of lead-free solders. Electron Process Technol. 2001;22(5):192.

    Google Scholar 

  31. Fallahi H, Nurulakmal MS, Arezodar AF, Abdullah J. Effect of iron and indium on IMC formation and mechanical properties of lead-free solder. Mater Sci Eng A. 2012;553:22.

    Article  CAS  Google Scholar 

  32. Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H. Sn–Ag–Cu nanosolders: melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system. CALPHAD: Comput Coupling Phase Diagrams Thermochem. 2015;49:101.

    Article  CAS  Google Scholar 

  33. Liu Q, Orme M. High precision solder droplet printing technology and the state-of-the-art. J Mater Process Technol. 2001;115(3):271.

    Article  CAS  Google Scholar 

  34. Jung DH, Sharma A, Jung JP. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn–Ag–Cu and a Cu conductor. J Alloys Compd. 2018;743:300.

    Article  CAS  Google Scholar 

  35. Ali B, Sabri MFM, Jauhari I, Sukiman NL. Impact toughness, hardness and shear strength of Fe and Bi added Sn–1Ag–0.5Cu lead-free solders. Microelectron Reliab. 2016;63:224.

    Article  CAS  Google Scholar 

  36. Wu CML, Yu DQ, Law CMT, Wang L. Properties of lead-free solder alloys with rare earth element additions. Mater Sci Eng R: Rep. 2004;44(1):1.

    Article  Google Scholar 

Download references

Acknowledgements

This study was financially supported by the National Key R&D Program of China (No. 2017YFB0305703).

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Authors and Affiliations

  1. General Research Institute for Nonferrous Metals, Beijing, 100088, China

    Ruo-Da Wang & Qiang Hu

  2. Beijing COMPO Advanced Technology Co., Ltd., Beijing, 101407, China

    Ruo-Da Wang, Qiang Hu, Shao-Ming Zhang, Fu-Wen Zhang, Cai-Tao Lu & Zhi-Gang Wang

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  1. Ruo-Da Wang
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  2. Qiang Hu
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Correspondence to Qiang Hu.

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Wang, RD., Hu, Q., Zhang, SM. et al. Properties of (Fe–B)-doped Sn–1.0Ag–0.5Cu solders prepared by mechanical alloying. Rare Met. 38, 665–674 (2019). https://doi.org/10.1007/s12598-019-01248-9

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  • DOI: https://doi.org/10.1007/s12598-019-01248-9

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