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Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy

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Abstract

The effect of the rotating magnetic field (RMF) on the microstructure and properties of Sn-1.0Ag-0.5Cu-0.5Sb-0.07Ce alloy was investigated. The phase composition of the solder was analyzed by X-ray diffraction (XRD), and the grain size, shape, and phase distribution of the solder were determined by optical microscope (OM), scanning electron microscope (SEM), and energy disperse spectroscopy (EDS). Then, the differential scanning calorimeter (DSC) was employed to evaluate the thermal characteristics of the solder. Finally, the universal mechanical testing machine was used to measure the mechanical properties of the solder at different strain rates. The results showed that the size of β-Sn was refined and the distribution was more uniform, intermetallic compounds (IMCs) developed from long-strip-like or block shape to finely granular, and the layer spacing decreased after the application of a rotating magnetic field. The pasty range and the melting point of solder decreased slightly (from 5 to 4.7 °C) with the RMF. Meanwhile, RMF processing led to an increase (about 13.4%) in the elongation (El.%) of alloy, and the mechanical properties of the solder were enhanced. The research serves as a helpful reference for the development of low-content lead-free solder, which provides a potential solution to the reliability problem of the lead-free joint.

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Funding

This work was funded by the National Natural Science Foundation of China (Nos. 51775388 and 11872048) and the Outstanding Young and Middle-aged Scientific Innovation Team of Colleges and Universities of Hubei Province (No. T2022015).

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Authors and Affiliations

  1. School of Mechanical Engineering and Automation, Wuhan Textile University, Wuhan, 430200, Hubei, China

    Zilong Wang, Fang Liu, Jie Liu, Jiacheng Zhou, Zhen Wang & Nu Yan

  2. Hubei Key Laboratory of Digital Textile Equipment, Wuhan Textile University, Wuhan, 430200, Hubei, China

    Fang Liu & Jiacheng Zhou

Authors
  1. Zilong Wang
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  2. Fang Liu
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  3. Jie Liu
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  4. Jiacheng Zhou
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  5. Zhen Wang
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  6. Nu Yan
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Contributions

All authors contributed to the study conception and design. ZW contributed to experiments, data curation and writing—original draft. JZ contributed to writing—review & editing. JL, ZW and NY contributed to investigation and collection of literature. Fang Liu contributed to writing—review & editing, resources, and project administration.

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Correspondence to Fang Liu or Jiacheng Zhou.

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Wang, Z., Liu, F., Liu, J. et al. Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy. J Mater Sci: Mater Electron 34, 504 (2023). https://doi.org/10.1007/s10854-023-09961-z

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  • DOI: https://doi.org/10.1007/s10854-023-09961-z

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