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Comparison of hot embossing micro structures with and without ultrasound

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Abstract

Hot embossing with and without ultrasound are compared in this paper with respect to several properties of the fabricated samples. The same mold was employed for both processes and process parameters have been chosen adapted to each process such that to the best knowledge of the authors good moldings were achieved. Shrinkage is similar for both processes. Better mold filling is achieved without ultrasound and the polymer structures correspond better to the mold after demolding. Undesired sample curvature is also much less. With ultrasound required investment costs and energy consumption are significantly less, and the cycle time is reduced to seconds.

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Correspondence to W. Zou.

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Zou, W., Sackmann, J., Striegel, A. et al. Comparison of hot embossing micro structures with and without ultrasound. Microsyst Technol 25, 4185–4195 (2019). https://doi.org/10.1007/s00542-019-04469-1

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  • DOI: https://doi.org/10.1007/s00542-019-04469-1

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