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Soft-Brittle Semiconductors Polishing with Environment-Friendly Slurries

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Micro and Nano Fabrication Technology

Part of the book series: Micro/Nano Technologies ((MNT))

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Abstract

A novel approach of chemical mechanical polishing (CMP) is developed for cadmium zinc telluride (CdZnTe or CZT) wafers. The approach uses environment-friendly slurry that consists of mainly silica, hydrogen peroxide, and citric acid. This is different from the previously reported slurries that are usually composed of strong acid, alkali, and bromine methanol and are detrimental to the environment and operators. Surface roughness 0.5 and 4.7 nm are achieved for Ra and peak-to-valley (PV) values, respectively, in a measurement area of 70 × 50 μm2, using the developed novel approach.

A novel approach of CMP is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers, and the lapping solution is deionized water. Secondly, the MCT wafers are polished using the developed CMP slurry. The CMP slurry consists of mainly SiO2 nanospheres, H2O2, and malic and citric acids, which are different from previous CMP slurries, in which corrosive and toxic chemical reagents are usually employed. Finally, the polished MCT wafers are cleaned and dried by deionized water and compressed air, respectively. The novel approach of CMP is environment-friendly. Surface roughness Ra and peak-to-valley (PV) values of 0.45 and 4.74 nm are achieved, respectively, on MCT wafers after CMP. The first and second passivation processes are observed in electrochemical measurements on MCT wafers. Fundamental polishing mechanisms are also investigated in terms of X-ray photoelectron spectroscopy (XPS) and electrochemical measurements.

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Correspondence to Zhenyu Zhang .

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© 2018 Springer Nature Singapore Pte Ltd.

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Zhang, Z., Wang, B., Guo, D. (2018). Soft-Brittle Semiconductors Polishing with Environment-Friendly Slurries. In: Yan, J. (eds) Micro and Nano Fabrication Technology. Micro/Nano Technologies. Springer, Singapore. https://doi.org/10.1007/978-981-13-0098-1_12

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