1. Transport Properties of Ni and PbTe Under Pressure

   • Matthew K. Jacobsen
   • Ravhi S. Kumar
   • Andrew L. Cornelius

   OriginalPaper 23 February 2012 Pages: 633 - 638

2. Simultaneous Increases in Electrical Conductivity and Seebeck Coefficient of PEDOT:PSS Films by Adding Ionic Liquids into a Polymer Solution

   • Congcong Liu
   • Jingkun Xu
   • Fangfang Kong

   OriginalPaper 17 February 2012 Pages: 639 - 645

3. Preparation of Ag Nanocomposite Tellurite Glass by Solid-State Field-Assisted Diffusion

   • Yan Ma
   • Jian Lin
   • Shuhua Lei

   OriginalPaper 17 February 2012 Pages: 646 - 650

4. Microstructure, Phase Transition, and Piezoelectric Properties of Cerium-Substituted Bismuth Titanate Nanofibers

   • Bo Jiang
   • Minghua Tang
   • John He

   OriginalPaper 17 February 2012 Pages: 651 - 655

5. Forming-Free Reversible Bipolar Resistive Switching Behavior in Al-Doped HfO₂ Metal–Insulator–Metal Devices

   • R. Mahapatra
   • A. B. Horsfall
   • N.G. Wright

   OriginalPaper 11 February 2012 Pages: 656 - 659

6. Grain Boundary Carrier Scattering in ZnO Thin Films: a Study by Temperature-Dependent Charge Carrier Transport Measurements

   • R.V. Muniswami Naidu
   • Aryasomayajula Subrahmanyam
   • D.M. Phase

   OriginalPaper 07 February 2012 Pages: 660 - 664

7. Structural, Optical, and Electrical Properties of Cobalt-Doped CdS Quantum Dots

   • M. Thambidurai
   • N. Muthukumarasamy
   • R. Balasundaraprabhu

   OriginalPaper 11 February 2012 Pages: 665 - 672

8. Optimization of Phase Formation and Superconducting Properties in MgB₂ Prepared by Phase Transformation from MgB₄

   • K. L. Tan
   • K. Y. Tan
   • S. K. Chen

   OriginalPaper 09 February 2012 Pages: 673 - 678

9. Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering

   • Tianbao Chen
   • Ping Fan
   • Zhaokun Cai

   OriginalPaper 01 February 2012 Pages: 679 - 683

10. Effects of Zn/Mg Ratio on the Microstructure and Microwave Dielectric Properties of (Zn_1−x Mg _x )₂SiO₄ Ceramics

    • Lingxia Li
    • Yucui Wang
    • Ping Zhang

    OriginalPaper 10 February 2012 Pages: 684 - 688

11. Impedance Spectroscopy of Dielectric BaTi₅O₁₁ Film Prepared by Laser Chemical Vapor Deposition Method

    • Dongyun Guo
    • Takashi Goto
    • Lianmeng Zhang

    OriginalPaper 23 February 2012 Pages: 689 - 694

12. Synthesis and Characterization of In₂S₃ Thin Films Deposited by Chemical Bath Deposition on Polyethylene Naphthalate Substrates

    • O.A. Castelo-González
    • H.C. Santacruz-Ortega
    • M. Sotelo-Lerma

    OriginalPaper 07 January 2012 Pages: 695 - 700

13. Low-Temperature Sintering and Electromagnetic Properties of NiCuZn/CaTiO₃ Composites

    • Haibo Yang
    • Yanyan Yang
    • Fen Wang

    BriefCommunication 18 February 2012 Pages: 701 - 705

14. Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package

    • K.-O. Lee

    OriginalPaper 23 February 2012 Pages: 706 - 711

15. Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

    • Hae-A-Seul Shin
    • Byoung-Joon Kim
    • Young-Chang Joo

    OriginalPaper 17 February 2012 Pages: 712 - 719

16. Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking

    • M. Murugesan
    • Y. Ohara
    • M. Koyanagi

    OriginalPaper 22 February 2012 Pages: 720 - 729

17. Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects

    • M. L. Huang
    • S. M. Zhou
    • L. D. Chen

    OriginalPaper 23 February 2012 Pages: 730 - 740

18. Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading

    • Q. S. Zhu
    • H. Y. Liu
    • J. K. Shang

    OriginalPaper 17 February 2012 Pages: 741 - 747

19. Observations of IMC Formation for Au Wire Bonds to Al Pads

    • John DeLucca
    • John Osenbach
    • Frank Baiocchi

    OriginalPaper 26 January 2012 Pages: 748 - 756

20. Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging

    • Kai-Jheng Wang
    • Jenq-Gong Duh

    OriginalPaper 11 February 2012 Pages: 757 - 762

21. Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish

    • Young Min Kim
    • Jin-Young Park
    • Young-Ho Kim

    OriginalPaper 23 February 2012 Pages: 763 - 773

22. Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method

    • J.W.C. Chin
    • C.K. Kok
    • M.R. Said

    OriginalPaper 07 February 2012 Pages: 774 - 781

23. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films

    • Gang Chen
    • Xiu-Hu Sun
    • Xu Chen

    OriginalPaper 08 February 2012 Pages: 782 - 790

24. Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

    • Jae-Myeong Kim
    • Myeong-Hyeok Jeong
    • Young-Bae Park

    OriginalPaper 25 January 2012 Pages: 791 - 799

25. Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

    • J. P. Tucker
    • D. K. Chan
    • C. A. Handwerker

    Erratum 22 February 2012 Pages: 800 - 800