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Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

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Abstract

The effects of surface finishes on the in situ interfacial reaction characteristics of ball grid array (BGA) Sn-3.0Ag-0.5Cu lead-free solder bumps were investigated under annealing and electromigration (EM) test conditions of 130°C to 175°C with 5.0 × 103 A/cm2. During reflow and annealing, (Cu,Ni)6Sn5 intermetallic compound (IMC) formed at the interface of electroless nickel immersion gold (ENIG) finish. In the case of both immersion Sn and organic solderability preservative (OSP) finishes, Cu6Sn5 and Cu3Sn IMCs formed. Overall, the IMC growth velocity of ENIG was much lower than that of the other finishes. The activation energies of total IMCs were found to be 0.52 eV for ENIG, 0.78 eV for immersion Sn, and 0.72 eV for OSP. The ENIG finish appeared to present an effective diffusion barrier between the Cu substrate and the solder, which leads to better EM reliability in comparison with Cu-based pad systems. The failure mechanisms were explored in detail via in situ EM tests.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Andong National University, Andong, 760-749, Korea

    Jae-Myeong Kim, Myeong-Hyeok Jeong & Young-Bae Park

  2. Korea Institute of Industrial Technology, Micro-Joining Center, Incheon, 406-840, Korea

    Sehoon Yoo

Authors
  1. Jae-Myeong Kim
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  2. Myeong-Hyeok Jeong
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  3. Sehoon Yoo
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  4. Young-Bae Park
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Correspondence to Young-Bae Park.

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Kim, JM., Jeong, MH., Yoo, S. et al. Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps. J. Electron. Mater. 41, 791–799 (2012). https://doi.org/10.1007/s11664-011-1888-2

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  • DOI: https://doi.org/10.1007/s11664-011-1888-2

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