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Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging

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Abstract

Sputtered Ti/Ni(V)/Cu under bump metallization (UBM) is widely used in flip chip technology because the metals are nonmagnetic and the consumption of the Ni(V) layer is low. It is noted that V does not react with solders and intermetallic compounds (IMC) during reflow and aging; however, a Sn-patch forms in the Ni(V) layer, and the Sn-patch growth may cause the IMCs to detach from the interface of solder joints. In this study, Sn-3.0Ag-0.5Cu solder was reflowed on Ti/Ni(V)/Cu UBM with different Cu thicknesses at 250°C for 60 s, and then aged at 150°C for various periods of time. It was revealed that the Sn-patch growth could be controlled by increasing the Cu thickness in the Ti/Ni(V)/Cu UBM. A feasible approach to suppress Sn-patch formation after reflow and aging is discussed.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan

    Kai-Jheng Wang & Jenq-Gong Duh

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  1. Kai-Jheng Wang
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  2. Jenq-Gong Duh
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Correspondence to Jenq-Gong Duh.

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Wang, KJ., Duh, JG. Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging. J. Electron. Mater. 41, 757–762 (2012). https://doi.org/10.1007/s11664-012-1925-9

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  • DOI: https://doi.org/10.1007/s11664-012-1925-9

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