Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit J. HarrisO. GraudejusS. Wagner OriginalPaper Open access 07 April 2011 Pages: 1335 - 1344
Characterization and Properties of Nickel Aluminide Nanocrystals in an Alumina Layer for Nonvolatile Memory Applications Dong-Hau KuoYung-Chuan ChenJinn P. Chu OriginalPaper 19 February 2011 Pages: 1345 - 1349
Stabilization of the Thermal Decomposition of Poly(Propylene Carbonate) Through Copper Ion Incorporation and Use in Self-Patterning Todd J. SpencerYu-Chun ChenPaul A. Kohl OriginalPaper 03 March 2011 Pages: 1350 - 1363
Study of Synthesis and Temperature Dependence of DC Conductivity in the Low Temperature Range for Poly(N-Methylaniline) Atul KapilSubhash Chand OriginalPaper 12 February 2011 Pages: 1364 - 1368
The Effect of Doping with the Polymer Metallic Complex Poly Zinc Acrylate on Superconducting Bulk MgB2 Zili ZhangHongli SuoMeiling Zhou OriginalPaper 19 February 2011 Pages: 1369 - 1376
Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging R. K. GoyalP. JadhavA. N. Tiwari OriginalPaper 04 February 2011 Pages: 1377 - 1383
A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices Takashi OnishiMasao MizunoYasuharu Shirai OriginalPaper 08 February 2011 Pages: 1384 - 1393
Silver Nanoparticle Paste for Low-Temperature Bonding of Copper Hani AlarifiAnming HuY. Norman Zhou OriginalPaper 01 March 2011 Pages: 1394 - 1402
Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders Tina VenturaYoung-Hee ChoArne K. Dahle OriginalPaper 05 February 2011 Pages: 1403 - 1408
Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation T. T. NguyenD. YuS. B. Park OriginalPaper 12 February 2011 Pages: 1409 - 1415
Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint Limin MaFeng TaiXitao Wang OriginalPaper 25 February 2011 Pages: 1416 - 1421
Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding F. D. DanaherJ. J. WilliamsN. Chawla OriginalPaper 01 March 2011 Pages: 1422 - 1427
Cr-Doped III–V Nitrides: Potential Candidates for Spintronics B. AminS. ArifK. Prisbrey OriginalPaper 19 February 2011 Pages: 1428 - 1436
Interpretation of Absolute Laser Reflectance During Optical Monitoring of Polycrystalline GaAs Deposition on Quartz Using Metalorganic Chemical Vapor Deposition Andrew J. ClaytonStuart J. C. Irvine OriginalPaper 25 February 2011 Pages: 1437 - 1443
Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds Y. HuangH. J. KimY. N. Zhou OriginalPaper 03 March 2011 Pages: 1444 - 1451
Effects of Annealing on Structural and Electrical Properties of CuInSe2 Thin Films Prepared by Hybrid Sputtering/Evaporation Processes Qifeng HanQiang LiuWangzhou Shi OriginalPaper 09 March 2011 Pages: 1452 - 1456
Gettered GaP Substrates for Improved Multijunction Solar Cell Devices K. H. MontgomeryC. R. AllenJ. M. Woodall OriginalPaper 11 March 2011 Pages: 1457 - 1460
Effect of Sputtered ZnO Layers on Behavior of Thin-Film Transistors Deposited at Room Temperature in a Nonreactive Atmosphere M. I. Medina-MontesS. H. LeeR. Ramírez-Bon OriginalPaper 09 April 2011 Pages: 1461 - 1469
Improved Electrical Performance and Reliability of Poly-Si TFTs Fabricated by Drive-In Nickel-Induced Crystallization with Chemical Oxide Layer Ming-Hui LaiYewChung Sermon WuChih-Pang Chang OriginalPaper 08 February 2011 Pages: 1470 - 1475