Electrical and Optical Characterization of Melt-Grown Bulk InAs1−y P y Crystals J. WeiJ. BarnesG. Rajagopalan OriginalPaper 08 December 2010 Pages: 103 - 108
Molecular Dynamics Simulation of MBE Growth of CdTe/ZnTe/Si Zhenli ZhangAlok ChatterjeePeter W. Chung OriginalPaper 25 November 2010 Pages: 109 - 121
Cu(In,Ga)Se2 Thin Film Preparation from a Cu(In,Ga) Metallic Alloy and Se Nanoparticles by an Intense Pulsed Light Technique Sanjay R. DhageHak-Sung KimH. Thomas Hahn OriginalPaper Open access 08 December 2010 Pages: 122 - 126
The Difference Between Thermo- and Pyroelectric Co-Based Rare-Earth (Nd, Y, Gd, Ce) Oxide Composites Measured Using a High Temperature Gradient Wilfried WunderlichHiroyuki Fujiwara OriginalPaper 25 November 2010 Pages: 127 - 133
Transformable Oxidation of Tantalum in Electrochemical Mechanical Polishing (ECMP) F. GaoH. Liang OriginalPaper 08 December 2010 Pages: 134 - 140
Flexible Polyarylene Ether Nitrile/BaTiO3 Nanocomposites with High Energy Density for Film Capacitor Applications Hailong TangJiachun ZhongXiaobo Liu OriginalPaper 19 November 2010 Pages: 141 - 148
Synthesis, Characterization, and Photovoltaic Properties of Poly(3-Phenyl Azomethine Alkylthiophene) Polymers B. PokhrelI. R. KamrupiS. K. Dolui OriginalPaper 15 December 2010 Pages: 149 - 156
Anomalous Peak in the Forward-Bias C–V Plot and Temperature-Dependent Behavior of Au/PVA (Ni,Zn-doped)/n-Si(111) Structures Tuncay TunçŞemsettin AltındalHabibe Uslu OriginalPaper 15 December 2010 Pages: 157 - 164
Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints G. Y. LiX. D. BiX. Q. Shi OriginalPaper 08 December 2010 Pages: 165 - 175
Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints Ming YangMingyu LiLvqian Weng OriginalPaper 07 December 2010 Pages: 176 - 188
Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System M. B. ZhouX. MaX. P. Zhang OriginalPaper 25 November 2010 Pages: 189 - 194
Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders E. ÇadIrlIU. BöyükY. Ocak OriginalPaper 08 December 2010 Pages: 195 - 200
Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction John W. ElmerEliot D. Specht OriginalPaper Open access 15 December 2010 Pages: 201 - 212
Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple Aditya KumarZhong Chen OriginalPaper 15 December 2010 Pages: 213 - 223
Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages Bo-In NohJeong-Won YoonSeung-Boo Jung OriginalPaper 25 November 2010 Pages: 224 - 231
Electrical Resistance and Microstructural Changes of Silver–Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat Sun-Sik KimKeun-Soo KimHirokazu Tanaka OriginalPaper 25 November 2010 Pages: 232 - 238
Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts Ute GeisslerJürgen FunckHerbert Reichl OriginalPaper 07 December 2010 Pages: 239 - 246