Predicting and Understanding Order of Heteroepitaxial Quantum Dots Lawrence H. Friedman OriginalPaper Open access 19 September 2007 Pages: 1546 - 1554
Microstructural Aspects of Nucleation and Growth of (In,Ga)As-GaAs(001) Islands with Low Indium Content V.P. KladkoV.V. StrelchukG.J. Salamo OriginalPaper 02 October 2007 Pages: 1555 - 1561
Effect of Electron–Electron Interaction on Nonlinear Near-Resonance Electromagnetic Response of Quantum Dot Systems Victor BondarenkoMiroslaw ZałużnyYang Zhao OriginalPaper 20 September 2007 Pages: 1562 - 1566
Biomolecule-Assisted Synthetic Route to Nanostructured Crystals: Synthesis of CdS Hierarchical Dendrites Fengyan SunQing YangYu Wu OriginalPaper 19 September 2007 Pages: 1567 - 1573
Optical Properties and Microstructure of Silver-Copper Nanoparticles Synthesized by Pulsed Laser Deposition Makoto HiraiAshok Kumar OriginalPaper 28 September 2007 Pages: 1574 - 1578
Cavity Quantum Electrodynamics, Nanophotonics, and Quantum Communication with Atomically Doped Carbon Nanotubes I.V. Bondarev OriginalPaper 19 September 2007 Pages: 1579 - 1586
Thermo-optical Responses of Nanoparticles: Melting of Ice and Nanocalorimetry Approach Hugh H. RichardsonAlyssa C. ThomasAlexander O. Govorov OriginalPaper 25 September 2007 Pages: 1587 - 1593
Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes Tao HangHuiqin LingDali Mao OriginalPaper 19 September 2007 Pages: 1594 - 1598
Ordered CdTe/CdS Arrays for High-Performance Solar Cells David ZubíaCesar LópezJohn McClure OriginalPaper 19 September 2007 Pages: 1599 - 1603
Electrical Characterization of Defects Introduced During Sputter Deposition of Schottky Contacts on n-type Ge F.D. AuretS. CoelhoJ.M. Nel OriginalPaper 21 September 2007 Pages: 1604 - 1607
The Effect of Low-Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solders Jenn-Ming SongZong-Mou WuHsin-Yi Chuang OriginalPaper 18 September 2007 Pages: 1608 - 1614
On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys Rajen S. SidhuShantanu V. MadgeNikhilesh Chawla OriginalPaper 18 September 2007 Pages: 1615 - 1620
Electron and Hole Capture Cross-Sections of Fe Acceptors in GaN:Fe Epitaxially Grown on Sapphire T. AggerstamA. PinosS. Lourdudoss OriginalPaper Open access 14 September 2007 Pages: 1621 - 1624
Influence of Ta-based Diffusion Barriers on the Microstructure of Copper Thin Films M. StanglA. FletcherK. Wetzig OriginalPaper 19 September 2007 Pages: 1625 - 1629
Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish Feng GaoHiroshi NishikawaTadashi Takemoto OriginalPaper 19 September 2007 Pages: 1630 - 1634
Influence of Bonding Temperature and Applied Load on the Bonding Integrity and Optical Performance of Face-Down Bonded Ridge-Waveguide Lasers J.W. Ronnie TeoZ.F. WangS. Yuan OriginalPaper 19 September 2007 Pages: 1635 - 1642
Ultraviolet Photodetection Properties of a Pt Contact on a Mg0.1Zn0.9O/ZnO Composite Film S. MridhaR. GhoshD. Basak OriginalPaper 19 September 2007 Pages: 1643 - 1647
Superconducting and Transport Properties of (Bi-Pb)-Sr-Ca-Cu-O with Nano-Cr2O3 Additions Kong WeiR. Abd-Shukor OriginalPaper 19 September 2007 Pages: 1648 - 1651
Wet Oxidation in a Square Sandwich Composite of GaAs/AlAs/GaAs Sun-Chien KoSanboh LeeY.T. Chou OriginalPaper 19 September 2007 Pages: 1652 - 1657
Fabrication of Cu(Ti) Alloy Interconnects with Self-Formation of Thin Barrier Metal Layers Using a High-Pressure Annealing Process S. TsukimotoT. OnishiM. Murakami BriefCommunication 21 September 2007 Pages: 1658 - 1661
Thermal Stability of Nitride-Based Diffusion Barriers for Ohmic Contacts to n-GaN L.F. VossL. StaffordI.I. Kravchenko OriginalPaper 21 September 2007 Pages: 1662 - 1668
Oxidation Behavior of Molten Tin Doped with Phosphorus Ai-Ping XianGuo-Liang Gong OriginalPaper 21 September 2007 Pages: 1669 - 1678
Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads Weiqun PengMarco Elisio Marques OriginalPaper 26 September 2007 Pages: 1679 - 1690
Creep Life Assessment of Tin-Based Lead-Free Solders Based on Imaginary Initial Strain Rate Kenji Monden OriginalPaper 22 September 2007 Pages: 1691 - 1696
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy Tung-Han ChuangHsiu-Jen LinChih-Chien Chi OriginalPaper 21 September 2007 Pages: 1697 - 1702
Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy R. MahmudiA. R. GeranmayehM. Bakherad OriginalPaper 21 September 2007 Pages: 1703 - 1710
Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging Kyoung-sik MoonC.P. WongKwang S. Suh OriginalPaper 25 September 2007 Pages: 1711 - 1718
Evolution of Contact Resistance during the Bonding Process of NCA Flip-Chip Interconnections H. YuS.G. MhaisalkarE.H. Wong OriginalPaper 26 September 2007 Pages: 1719 - 1723
He Ion Implantation and the Refractive Index Depth Profile in Relaxor Ferroelectric Optical Waveguides P.D. MoranA. ChenH. Bakhru OriginalPaper 22 September 2007 Pages: 1724 - 1731
Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers Shih-Kang LinYuhi YorikadoIsamu Yanada BriefCommunication Open access 19 September 2007 Pages: 1732 - 1734
Photothermal Activation of Shallow Dopants Implanted in Silicon A.T. FioryA. StevensonN.M. Ravindra OriginalPaper 05 October 2007 Pages: 1735 - 1747
