Effect of reducing atmosphere on the structure of ceria-supported nano-pt catalysts M. ShamsuzzohaE. T. AdaR. G. Reddy OriginalPaper Pages: 808 - 813
Microstructural evolution of nickel nanoparticle catalysts supported on gadolinium-doped ceria during autothermal reforming of iso-octane Velmurugan PalaniyandiMohammad ShamsuzzohaRamana G. Reddy OriginalPaper Pages: 814 - 821
Nano-engineering approaches to self-assembled InAs quantum dot laser medium S. OktyabrskyV. TokranovM. Yakimov OriginalPaper Pages: 822 - 833
Ion beam mixing for processing of nanostructure materials S. AbedrabboD. E. ArafahN. M. Ravindra OriginalPaper Pages: 834 - 839
Epitaxial ZnO/Pt layered structures and ZnO-Pt nanodot composites on sapphire (0001) Amit ChughS. RamachandranJ. Narayan OriginalPaper Pages: 840 - 845
Designing nanostructures for sensor applications Y. -P. ZhaoS. -H. LiW. Kisaalita OriginalPaper Pages: 846 - 851
Co-doped ZnO dilute magnetic semiconductor John T. PraterShivaraman RamachandranJagdish Narayan OriginalPaper Pages: 852 - 856
Effects of grain size from millimeters to nanometers on the flow stress of metals and compounds Hans ConradKang Jung OriginalPaper Pages: 857 - 861
ZnO spintronics and nanowire devices S. J. PeartonD. P. NortonA. F. Hebard OriginalPaper Pages: 862 - 868
Structural and optical properties of hexagonal MgxZn1−xO thin films Chunming JinRoger J. Narayan OriginalPaper Pages: 869 - 876
Rapid thermal processing of silicon wafers with emissivity patterns M. RabusA. T. FioryW. Mansfield OriginalPaper Pages: 877 - 891
Electromagnetic characteristics of nanometer manganese dioxide composite materials Hongtao GuanShunhua LiuYuping Duan OriginalPaper Pages: 892 - 896
Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints Yanghua XiaChuanyan LuXiaoming Xie OriginalPaper Pages: 897 - 904
Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives F. GaoT. TakemotoA. Komatsu OriginalPaper Pages: 905 - 911
A study of electrically conductive adhesives as a manufacturing solder alternative F. M. CoughlanH. J. Lewis OriginalPaper Pages: 912 - 921
Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-Rich corner Chih-Chi ChenSinn-Wen ChenChing-Ya Kao OriginalPaper Pages: 922 - 928
Effect of Zn content on the vibration fracture behavior of Sn-Zn and Sn-Zn-Bi solders Jenn-Ming SongTruan-Sheng LuiLi-Hui Chen OriginalPaper Pages: 929 - 936
Arsenic redistribution induced by low-temperature Ni silicidation at 450°C on shallow junctions Yu-Long JiangGuo-Ping RuWayne Holland OriginalPaper Pages: 937 - 940
Synthesis of low-melting metal oxide and sulfide nanowires and nanobelts R. RaoH. ChandrasekaranA. M. Rao OriginalPaper Pages: 941 - 946
Temperature and current-density distributions in flip-chip solder joints with Cu traces C. Y. HsuD. J. YaoEverett C. C. Yeh OriginalPaper Pages: 947 - 953
A thermomechanical study of the electrical resistance of Cu lead interconnections D. S. LiuC. Y. ChenY. C. Chao OriginalPaper Pages: 958 - 965
Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging Chih-Yao LiuMoo-Chin WangMin-Hsiung Hon OriginalPaper Pages: 966 - 971
Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis Yi-Shao LaiChin-Li Kao OriginalPaper Pages: 972 - 977
Dissolution behavior of Cu and Ag substrates in molten solders Po-Yi YehJenn-Ming SongKwang-Lung Lin OriginalPaper Pages: 978 - 987
Influence of space charge on lux-ampere characteristics of high-resistivity CdTe J. FrancR. GrillP. Höschl OriginalPaper Pages: 988 - 992
Laser forming of silicon films using nanoparticle precursor Sachin BetAravinda Kar OriginalPaper Pages: 993 - 1004
Local melting induced by electromigration in flip-chip solder joints C. M. TsaiY. L. LinC. R. Kao OriginalPaper Pages: 1005 - 1009
Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints Y. L. LinC. W. ChangC. R. Kao OriginalPaper Pages: 1010 - 1016
Effects of limited cu supply on soldering reactions between SnAgCu and Ni C. E. HoY. W. LinD. S. Jiang OriginalPaper Pages: 1017 - 1024
Mechanical integrity evaluation of low-k device with bump shear Peng SuJie-Hua ZhaoDavid Wontor OriginalPaper Pages: 1025 - 1031
Reliability testing of WLCSP lead-free solder joints Huann-Wu ChiangJun-Yuan ChenGary Shiau OriginalPaper Pages: 1032 - 1040
Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates Jenn-Ming SongHsin-Yi ChuangZong-Mou Wu OriginalPaper Pages: 1041 - 1049
Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach Martin A. RistW. J. PlumbridgeS. Cooper OriginalPaper Pages: 1050 - 1058
Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques Iting TsaiEnboa WuT. H. Chuang OriginalPaper Pages: 1059 - 1066
Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating Hoe-Rok JungHyuk-Hwan KimWon-Jong Lee OriginalPaper Pages: 1067 - 1073
Direct measurement of local surface temperature of eutectic solder for determining electromigration pattern T. HasegawaM. SakaY. Watanabe OriginalPaper Pages: 1074 - 1081
Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests K. N. ChenS. M. ChangR. Reif OriginalPaper Pages: 1082 - 1086
Effect of the polymer matrices on the dielectric behavior of a percolative high-k polymer composite for embedded capacitor applications Jianwen XuC. P. Wong OriginalPaper Pages: 1087 - 1094
Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys Weimin XiaoYaowu ShiFu Guo OriginalPaper Pages: 1095 - 1103
Ammonothermal synthesis of aluminum nitride crystals on group III-nitride templates B. T. AdekoreK. RakesZ. Sitar OriginalPaper Pages: 1104 - 1111
Electron-beam hardening of thin films of functionalized polynorbornene copolymer Seongho ParkJeff KrotinePaul A. Kohl OriginalPaper Pages: 1112 - 1121
Analysis of nonexponential deep-level current transients in schottky diodes fabricated on [1\(\bar 1\)00] 6H-SiC00] 6H-SiC A. BolotnikovP. MuzykovT. S. Sudarshan OriginalPaper Pages: 1122 - 1126
Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate Hiroshi NishikawaJin Yu PiaoTadashi Takemoto OriginalPaper Pages: 1127 - 1132
Ultradense GaN nanopillar and nanopore arrays by self-assembly nanopatterning N. A. KouklinJ. Liang OriginalPaper Pages: 1133 - 1137
