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Dissolution behavior of Cu and Ag substrates in molten solders

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Abstract

This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, 701, Tainan, Taiwan

    Po-Yi Yeh & Kwang-Lung Lin

  2. Department of Materials Science and Engineering, National Dong Hwa University, 974, Hualien, Taiwan

    Jenn-Ming Song

Authors
  1. Po-Yi Yeh
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  2. Jenn-Ming Song
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  3. Kwang-Lung Lin
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Yeh, PY., Song, JM. & Lin, KL. Dissolution behavior of Cu and Ag substrates in molten solders. J. Electron. Mater. 35, 978–987 (2006). https://doi.org/10.1007/BF02692557

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  • DOI: https://doi.org/10.1007/BF02692557

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