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Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging

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Abstract

The reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging has been investigated. Due to the growth and decomposition of the intermetallic compound (IMC), the adhesion strength varies with aging at 150°C from 100, 400, and 700–1,000 h as wetted at 250°C for 60 sec. The IMC layers are determined at the Sn-9Zn-1.5Ag-0.5Bi/Cu interface by an x-ray diffractometer (XRD), an optical microscope (OM), a scanning electron microscope (SEM), an energy-dispersive spectroscope (EDS), and a transmission electron microscope (TEM). The adhesion strength has been investigated by the pull-off test. The results show that the Cu6Sn5, Cu5Zn8, and Ag3Sn IMCs are identified at the Sn-9Zn-1.5Ag-0.5Bi/Cu interface as aging. The adhesion strengths are 12.44±0.58, 8.57±0.43, 5.50±0.78, 4.32±0.78, and 3.32±0.43 MPa for aging times of 0 h, 100 h, 400 h, 700 h, and 1,000 h, respectively.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, 70101, Tainan, Taiwan

    Chih-Yao Liu & Min-Hsiung Hon

  2. Department of Materials Science and Engineering National United University, 1 Lien Da, Kung-Ching Li, 360, Miao Li, Taiwan

    Moo-Chin Wang

  3. Dayeh University, 515, Changhua, Taiwan

    Min-Hsiung Hon

Authors
  1. Chih-Yao Liu
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  2. Moo-Chin Wang
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  3. Min-Hsiung Hon
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Liu, CY., Wang, MC. & Hon, MH. Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging. J. Electron. Mater. 35, 966–971 (2006). https://doi.org/10.1007/BF02692555

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  • DOI: https://doi.org/10.1007/BF02692555

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