Suppression of tin whisker formation on fine pitch connectors by surface roughening Makoto TakeuchiKouichi KamiyamaKatsuaki Suganuma Special Issue Paper Pages: 1918 - 1925
Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction Yoshikazu TakakuIkuo OhnumaKiyohito Ishida Special Issue Paper Pages: 1926 - 1932
Thermal stability of Cu(W) and Cu(Mo) films for advanced barrierless Cu metallization: Effects of annealing time J. P. ChuC. H. Lin Special Issue Paper Pages: 1933 - 1936
Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls Chih-Ming ChenHuei-Chuan Lin Special Issue Paper Pages: 1937 - 1947
Kinetics of AuSn4 migration in lead-free solders C. W. ChangC. E. HoC. R. Kao Special Issue Paper Pages: 1948 - 1954
Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures S. J. WangC. Y. Liu Special Issue Paper Pages: 1955 - 1960
Electromigration effects on intermetallic growth at wire-bond interfaces H. T. OrchardA. L. Greer Special Issue Paper Pages: 1961 - 1968
Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method Machiko OdeMinoru UeshimaHidehiro Onodera Special Issue Paper Pages: 1969 - 1974
Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering Sun-Kyoung SeoMoon Gi ChoWon Kyoung Choi Special Issue Paper Pages: 1975 - 1981
Lowering of Sn−Sb alloy melting points caused by substrate dissolution Sinn-Wen ChenPo-Yin ChenChao-Hong Wang Special Issue Paper Pages: 1982 - 1985
Metal-semiconductor amorphous and nanoscale Ge-phase composites produced by rapid solidification and by devitrification of an amorphous matrix D. V. Louzguine-LuzginA. Inoue Special Issue Paper Pages: 1986 - 1992
in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis Luhua XuJohn H. L. Pang Special Issue Paper Pages: 1993 - 1999
Development of a high-strength high-conductivity Cu−Ni−P alloy. Part II: Processing by severe deformation A. BelyakovM. MurayamaT. Kimura Regular Issue Paper Pages: 2000 - 2008
High dielectric constant polymer-ceramic (Epoxy varnish-barium titanate) nanocomposites at moderate filler loadings for embedded capacitors Jianwen XuSwapan BhattacharyaC. P. Wong Regular Issue Paper Pages: 2009 - 2015
Model of shear viscosity for underfill flows R. YangD. C. SunSeungbae Park Regular Issue Paper Pages: 2016 - 2025
Effect of settlement on dense slurry flow in a horizontal channel R. YangD. C. SunSeungbae Park Regular Issue Paper Pages: 2026 - 2034
Thermally stable Ge/Cu/Ti ohmic contacts to n-type GaN Nadeemullah MahadikMulpuri V. RaoAlbert V. Davydov Regular Issue Paper Pages: 2035 - 2040
Effect of glass frit chemistry on the physical and electrical properties of thick-film Ag contacts for silicon solar cells Mohamed M. HilaliSrinivasan SridharanSteve Kim Regular Issue Paper Pages: 2041 - 2047
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability Sang-Ah GamHyoung-Joon KimKyung-Wook Paik Regular Issue Paper Pages: 2048 - 2055
Realization of very long wavelength infrared photovoltaic detector arrays on mercury cadmium telluride epitaxial layers grown on Si substrates S. GuptaV. GopalR. P. Tandon Regular Issue Paper Pages: 2056 - 2060
elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging Guh-Yaw JangJenq-Gong Duh Regular Issue Paper Pages: 2061 - 2070
