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in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis

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Abstract

The phenomenon of electromigration in Pb-free Sn−Ag−Cu solder joint specimens subject to high current density was characterized. Digital image speckle analysis (DISA) was used to measure the in-situ microdeformation and strain of cross-sectioned solder joints, which are subject to electromigration with a current density of 5 × 103 A/cm2 under an ambient temperature of 150°C. After a 120 h electromigration test, a higher strain near large voids was detected near preexisting voids in the solder joints. The current-crowding effect on strain formation was characterized, as it was found that the strain is high near the interface, while in the middle of the solder bump, the strain is low and could be neglected. Nanoindentation markers were used to form dummy voids to study the effect of preexisting voids. The Sn atomic flux and its effect on formation of electromigration strain are discussed.

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References

  1. K.N. Tu, J. Appl. Phys. 94, 5451 (2003).

    Article  CAS  Google Scholar 

  2. D.G. Pierce and P.G. Brusius, Microelectron. Reliab. 37, 1053 (1997).

    Article  Google Scholar 

  3. M. Tammaro, J. Appl. Phys. 86, 3612 (1999).

    Article  CAS  Google Scholar 

  4. K. Zeng and K.N. Tu, Mater. Sci. Eng. R, 38, 55 (2002).

    Article  Google Scholar 

  5. J.H.L. Pang and X.Q. Shi, Proc. 53rd Electronic Components and Technology Conf. (Piscataway NJ: IEEE, 2003), pp. 926–932.

    Book  Google Scholar 

  6. Y.F. Sun, J.H.L. Pang, K.W. Chee, and F. Su, Appl. Opt. 44, 7357 (2005).

    Article  Google Scholar 

  7. I.A. Blech Appl. Phys. Lett. 29, 131 (1976).

    Article  CAS  Google Scholar 

  8. T.Y. Lee, K.N. Tu, and D.R. Frear, J. Appl. Phys. 90, 4502 (2001).

    Article  CAS  Google Scholar 

  9. T.Y. Lee, K.N. Tu, S.M. Kuo, and D.R. Frear, J. Appl. Phys. 89, 3189 (2001).

    Article  CAS  Google Scholar 

  10. J.W. Nah, F. Ren, and K.N. Tu, J. Appl. Phys. 99, 023520 (2006).

    Article  Google Scholar 

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Authors and Affiliations

  1. School of Mechanical & Aerospace Engineering Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore

    Luhua Xu & John H. L. Pang

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  1. Luhua Xu
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  2. John H. L. Pang
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Xu, L., Pang, J.H.L. in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis. J. Electron. Mater. 35, 1993–1999 (2006). https://doi.org/10.1007/s11664-006-0305-8

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  • DOI: https://doi.org/10.1007/s11664-006-0305-8

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