Low-cycle fatigue characteristics of Sn-based solder joints K. O. LeeJin YuS. B. Lee Regular Issue Paper Pages: 249 - 257
Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect I. DuttaB. S. MajumdarZ. X. Wang Regular Issue Paper Pages: 258 - 270
Characterization of nonconductive adhesives for flip-chip interconnection Lay Kuan TehChee Cheong WongEe Hua Wong Regular Issue Paper Pages: 271 - 276
Reaction characteristics of the In-15Pb-5Ag solder with a Au/Ni/Cu pad and their effects on mechanical properties Jong-Hyun LeeYong-Seong EomYong-Seog Kim Regular Issue Paper Pages: 277 - 282
Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps Chien-Sheng HuangGuh-Yaw JangJenq-Gong Duh Regular Issue Paper Pages: 283 - 289
Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition Jong-Ning AohCheng-Li Chuang Regular Issue Paper Pages: 290 - 299
Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding Jong-Ning AohCheng-Li Chuang Regular Issue Paper Pages: 300 - 311
Transparent flexible plastic substrates for organic light-emitting devices Yongtaek HongZhiqi HeJerzy Kanicki Regular Issue Paper Pages: 312 - 320
Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects Yoshiharu KariyaTakuya HosoiMasahisa Otsuka Regular Issue Paper Pages: 321 - 328
Low-cycle fatigue prediction model for pb-free solder 96.5Sn-3.5Ag C. KanchanomaiY. Mutoh Regular Issue Paper Pages: 329 - 333
Experimental investigation on mechanisms of silicon chemical mechanical polishing E. EstragnatG. TangJ. M. Martin Regular Issue Paper Pages: 334 - 339
Phase transformations in thermally exposed Au-Al ball bonds Naren NooluNikhil MurdeshwarWilliam Baeslack III Regular Issue Paper Pages: 340 - 352
High mobility poly-Ge thin-film transistors fabricated on flexible plastic substrates at temperatures below 130°C D. ShahrjerdiB. HekmatshoarM. Robertson Regular Issue Paper Pages: 353 - 357
Etching of As- and P-based III–V semiconductors in a planar inductively coupled BCl3/Ar plasma J. W. LeeW. T. LimS. J. Pearton Regular Issue Paper Pages: 358 - 363
Thermal desorption of Ge native oxides and the loss of Ge from the surface Jungwoo OhJoe C. Campbell Regular Issue Paper Pages: 364 - 367
Electromigration in sputtered copper film on plasma-treated hydrogen silsesquioxane dielectric Chi-Tong ChenBi-Shiou Chiou Regular Issue Paper Pages: 368 - 373
Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions T. H. ChuangK. W. HuangW. H. Lin Regular Issue Paper Pages: 374 - 381
Pulsed laser annealing of self-organized InAs/GaAs quantum dots S. ChakrabartiS. FathpourP. Bhattacharya Letter Pages: L5 - L8