1. Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces

   • Pei-Lin Wu
   • Meng-Kuang Huang
   • Shyh-Rong Tzan

   Regular Issue Paper Pages: 157 - 161

2. A novel structure of woven continuous-carbon fiber composites with high electromagnetic shielding

   • Wern Shiarng Jou

   Regular Issue Paper Pages: 162 - 170

3. Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages

   • M. D. Cheng
   • S. Y. Chang
   • T. H. Chuang

   Regular Issue Paper Pages: 171 - 180

4. The contact characteristics of SiCN films for opto-electrical devices applications

   • Wen-Rong Chang
   • Yean-Kuen Fang
   • Cheng-Nan Chang

   Regular Issue Paper Pages: 181 - 184

5. Characterization survey of Ga_xIn_1−xAs/InAs_yP_1−y double heterostructures and InAs_yP_1−y multilayers grown on InP

   • S. P. Ahrenkiel
   • M. W. Wanlass
   • H. R. Moutinho

   Regular Issue Paper Pages: 185 - 193

6. Comparative study of electrically conductive thick films with and without glass

   • Zongrong Liu
   • D. D. L. Chung

   Regular Issue Paper Pages: 194 - 202

7. Pressure electrical contact improved by carbon black paste

   • Chia-Ken Leong
   • D. D. L. Chung

   Regular Issue Paper Pages: 203 - 206

8. Oxygen segregation and Ge diffusion in annealed oxygen ion-implanted relaxed SiGe/Si heterostructures

   • Zhenghua An
   • Miao Zhang
   • Chenglu Lin

   Regular Issue Paper Pages: 207 - 212

9. Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices

   • C. A. Wang
   • D. A. Shiau
   • G. Nichols

   Regular Issue Paper Pages: 213 - 217

10. Study on Cu particles-enhanced SnPb composite solder

    • Yanfu Yan
    • Jianping Liu
    • Zhidong Xia

    Regular Issue Paper Pages: 218 - 223

11. Effect of spin coating on the curing rate of epoxy adhesive for the fabrication of a polymer optical waveguide

    • M. A. Uddin
    • H. P. Chan
    • Y. C. Chan

    Regular Issue Paper Pages: 224 - 228

12. Reactive interdiffusion between a lead-free solder and Ti/Ni/Ag thin-film metallizations

    • G. Ghosh

    Regular Issue Paper Pages: 229 - 240

13. Electrical and luminescent properties and the spectra of deep centers in GaMnN/InGaN light-emitting diodes

    • A. Y. Polyakov
    • N. B. Smirnov
    • J. M. Zavada

    Regular Issue Paper Pages: 241 - 247