Abstract
Spin coating is a simple process for rapidly depositing thin, solid polymeric films onto relatively flat substrates. Evaporation occurs during spinning of the relatively volatile species in any solution. The curing behavior of spin-coated polymeric film is influenced by the evaporation of any reactive component. An investigation was carried out on a silicon substrate to study the effects of spin coating on the curing behavior of the epoxy adhesive. The degree of curing for both spin and without spin-coated epoxy adhesive was measured by Fourier-transform infrared spectroscopy (FTIR). A slower curing reaction rate was observed for the spin-coated epoxy adhesive. The composition gradient established by solvent evaporation during spinning is responsible for the slower curing reaction rate of the spin-coated epoxy adhesive. From this study, it is proposed to use solvents that are less volatile and allow a greater part of the thinning behavior to occur without significant changes in the fluid properties during the spinning process.
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Uddin, M.A., Chan, H.P., Chow, C.K. et al. Effect of spin coating on the curing rate of epoxy adhesive for the fabrication of a polymer optical waveguide. J. Electron. Mater. 33, 224–228 (2004). https://doi.org/10.1007/s11664-004-0184-9
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DOI: https://doi.org/10.1007/s11664-004-0184-9