Ni, Pd, or Pt as contact materials for GaSb and InSb semiconductors: Phase diagrams Herbert IpserKlaus W. Richter Special Issue Paper Pages: 1136 - 1140
Effects of doping on the high-temperature thermoelectric properties of IrSb3 skutterudite compounds Sung Wng KimYoshisato KimuraYoshinao Mishima Special Issue Paper Pages: 1141 - 1147
Influences of ZnO buffer layers on the quality of ZnO films synthesized by the metal-organic chemical vapor deposition process Sun-Hong ParkChul-Hwan ChoiSeon-Hyo Kim Special Issue Paper Pages: 1148 - 1154
Paramagnetic-to-antiferromagnetic phase transformation in sputter-deposited Ni-Mn thin films Peter F. LadwigYing YangY. Austin Chang Special Issue Paper Pages: 1155 - 1159
The effects of quaternary additions on thermoelectric properties of TiNiSn-based half-heusler alloys Takahiro KatayamaSung Wng KimYoshinao Mishima Special Issue Paper Pages: 1160 - 1165
Planar defects and double-domain epitaxy in epitaxial YSi2−x and ErSi2−x thin films on Si substrates W. C. TsaiK. S. ChiL. J. Chen Special Issue Paper Pages: 1166 - 1170
High-resolution transmission electron microscopy of silicide formation and morphology development of Ni/Si and Ni/Si1−xGex X. ChenZ. ShiL. K. Rabenberg Special Issue Paper Pages: 1171 - 1181
The effect of Pd and Cu in the intermetallic growth of alloy Au wire Hen-So ChangKer-Chang HsiehAlbert Yang Special Issue Paper Pages: 1182 - 1187
Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems Sinn-Wen ChenShyr-Harn WuShou-Wei Lee Special Issue Paper Pages: 1188 - 1194
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment Jeong-Won YoonChang-Bae LeeSeung-Boo Jung Special Issue Paper Pages: 1195 - 1202
A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni J. Y. TsaiY. C. HuC. R. Kao Special Issue Paper Pages: 1203 - 1208
Intermetallic growth between lead-free solders and palladium Gaurav SharmaC. M. EichfeldS. E. Mohney Special Issue Paper Pages: 1209 - 1213
Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization S. C. HsuS. J. WangC. Y. Liu Special Issue Paper Pages: 1214 - 1221
Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization Ying-Chao HsuTung-Liang ShaoChih Chen Special Issue Paper Pages: 1222 - 1227
Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint Jong Hoon KimSang Won JeongHyuck Mo Lee Special Issue Paper Pages: 1228 - 1234
Sputtered copper films with insoluble Mo for Cu metallization: A thermal annealing study C. H. LinJ. P. ChuS. F. Wang Special Issue Paper Pages: 1235 - 1239
Formation and growth of intermetallics around metallic particles in eutectic Sn-Ag solder J. G. LeeK. C. ChenK. N. Subramanian Special Issue Paper Pages: 1240 - 1248
Interfaces in lead-free soldering Chi-Won HwangKeun-Soo KimKatsuaki Suganuma Special Issue Paper Pages: 1249 - 1256
Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints H. RheeF. GuoK. N. Subramanian Special Issue Paper Pages: 1257 - 1264
Thermodynamic database on microsolders and copper-based alloy systems X. J. LiuI. OhnumaT. Suzuki Special Issue Paper Pages: 1265 - 1272
Interfacial reactions and compound formation in the edge of PbSn flip-chip solder bumps on Ni/Cu under-bump metallization Chien-Sheng HuangGuh-Yaw JangJeng-Gong Duh Special Issue Paper Pages: 1273 - 1277
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization T. L. ShaoK. C. LinChih Chen Special Issue Paper Pages: 1278 - 1283
Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints Sinn-Wen ChenShou-Wei LeeMing-Chuen Yip Special Issue Paper Pages: 1284 - 1289
Thermodynamic modeling of the Au-In-Sn system H. S. LiuC. L. LiuZ. P. Jin Special Issue Paper Pages: 1290 - 1296
Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys Jae-Yong ParkChoong-Un KimViswanadham Puligandla Special Issue Paper Pages: 1297 - 1302
Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure S. J. WangC. Y. Liu Special Issue Paper Pages: 1303 - 1309
Effects of prestrain, rate of prestrain, and temperature on the stress-relaxation behavior of eutectic Sn-3.5Ag solder joints H. RheeK. N. Subramanian Special Issue Paper Pages: 1310 - 1316
A simple single-step diffusion and emitter etching process for high-efficiency gallium-antimonide thermophotovoltaic devices G. RajagopalanN. S. ReddyO. Sulima Special Issue Paper Pages: 1317 - 1321
Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry Baik-Woo LeeJu-Young KimDongil Kwon Special Issue Paper Pages: 1322 - 1329
Edge-emitting electroluminescence polarization investigation of InGaN/GaN light-emitting diodes grown by metal-organic chemical vapor deposition on sapphire (0001) D. I. FlorescuD. S. LeeE. A. Armour Special Issue Paper Pages: 1330 - 1334
Improved area density and luminescence properties of InP quantum dots grown on In0.5Al0.5P by metal-organic chemical vapor deposition X. B. ZhangR. D. HellerN. Holonyak Jr. Special Issue Paper Pages: 1335 - 1338
High-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding D. V. SinghL. ShiA. Grill Special Issue Paper Pages: 1339 - 1343
Semiconductor nanowires surrounded by cylindrical Al2O3 shells Byungdon MinJong Soo LeeJoo-Tae Moon Special Issue Paper Pages: 1344 - 1348
Self-aligned Ti germanosilicide formation on a polycrystalline Si/SiGe/Si extrinsic base for SiGe heterojunction bipolar transistors Seung-Yun LeeChan Woo ParkJin-Yoeng Kang Special Issue Paper Pages: 1349 - 1356
