Abstract
The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for various lengths of time. The tensile strengths of these annealed specimens are determined at room temperature. In addition, the interfacial reactions and fracture surfaces of the specimens are examined as well. These properties are important for the evaluation of the usage of Sn-0.7wt.%Cu lead-free solders, which has been not available in the literature. Only the Ni3Sn4 phase is formed at the Sn/Ni interface, but both the Cu6Sn5 and Ni3Sn4 phases are formed at the Sn-0.7wt.%Cu/Ni interface. The thickness of the intermetallic compound layers grows, while the joint strength decreases with longer reaction time. With a 1-h reaction at 200°C, the fracture surface is in the solder matrix for both of the two kinds of couples. Shifting toward the compound layer with longer reaction time, the fracture surface is in the Ni3Sn4 layer in the Sn/Ni couple and is at the interface between the Cu6Sn5 and Ni3Sn4 in the Sn-0.7wt.%Cu/Ni after reacting at 200°C for 240 h.
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References
R.J. Klein Wassink, Soldering in Electronics, 2nd ed. (Isle of Man, British Isles: Electrochemical Publications, 1989).
K.N. Tu and K. Zeng, Mater. Sci. Eng. R34, 1 (2001).
B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, and P. Cusack, Lead-Free Soldering: An Analysis of the Current Status of Lead-Free Soldering (Middlesex, UK: Department of Trade and Industry, 1999).
J. Glazer, Int. Mater. Rev. 40, 65 (1995).
W.J. Plumbridge, J. Mater. Sci. 31, 2501 (1996).
C.Y. Liu and S.J. Wang, J. Electron. Mater. 32, L1 (2003).
J.W. Jang, D.R. Frear, T.Y. Lee, and K.N. Tu, J. Appl. Phys. 88, 6359 (2000).
L.-H. Su, Y.-W. Yen, and S.-W. Chen, Metall. Mater. Trans. B 28B, 927 (1997).
S.-W. Chen and Y.-W. Yen, J. Electron. Mater. 28, 1202 (1999).
C.-Y. Huang and S.-W. Chen, J. Electron. Mater. 31, 152 (2002).
A.D. Romig, Jr., Y.A. Chang, J.J. Stephens, D.R. Frear, V. Marcotte, and C. Lea, Solder Mechanics: A State of the Art Assessment, ed. D.R. Frear, W.B. Jones, and K.R. Kinsman (Warrendale, PA: TMS, 1991), pp. 29–104.
H.T. Lee and M.H. Chen, Mater. Sci. Eng. 333, 24 (2002).
J. London and D.W. Ashall, Brazing Soldering 10, 17 (1986).
L. Qua, D. Frear, D. Grivas, and J.W. Morris, J. Electron. Mater. 16, 203 (1987).
D.E. Gray, American Institute of Physics Handbook (New York: McGraw-Hill, 1957), p. 2–77.
S.H. Huh, K.S. Kim, and K. Suganuma, Mater. Trans. 43, 239 (2002).
S.H. Huh, K.S. Kim, and K. Suganuma, Mater. Trans. 42, 739 (2001).
J.K. Lin, A.D. Silva, D. Frear, Y. Guo, J.W. Jang, L. Li, D. Mitchell, B. Yeung, and C. Zhang, 2001 Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 455–462.
C.M.L. Wu and M.L. Huang, J. Electron. Mater. 31, 442 (2002).
J.S. Hwang, Z. Guo, and H. Koenigsmann, Solder. Surface Mount Technol. 13, 7 (2001).
S.-W. Chen, S.-H. Wu, and S.-W. Lee, J. Electron. Mater., 32, 1188 (2003).
C.-H. Wang, (Master thesis, National Tsing Hua University, 2002).
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Chen, SW., Lee, SW. & Yip, MC. Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints. J. Electron. Mater. 32, 1284–1289 (2003). https://doi.org/10.1007/s11664-003-0024-3
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DOI: https://doi.org/10.1007/s11664-003-0024-3